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LM3S5R31-IQC80-C1

Texas Instruments

LM3S5R31-IQC80-C1 by Texas Instruments

LM3S5R31-IQC80-C1 by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, ADC and DMA channels. Operating at up to 0.032 MHz clock frequency, it features FLASH ROM programmability and supports PWM output. Ideal for industrial applications requiring a compact form factor and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,844 parts In-Stock

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Digiode

USA . 1,323 parts In-Stock

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One Stop Electronics

USA . 957 parts In-Stock

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$15.000

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957

$15.000

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AZTECH Wire

Italy . 273 parts In-Stock

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$16.269

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Parana Technologies

USA . 2,289 parts In-Stock

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$29.006

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$54.281

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$29.006

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DigiPath Technology Company

USA . 1,227 parts In-Stock

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$31.939

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$29.384

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$31.939

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ChromeModa Solutions

Germany . 4,683 parts In-Stock

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$32.591

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$26.725

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$32.591

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IDEA Electronic Components Group

UK . 729 parts In-Stock

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$32.591

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$30.961

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$29.332

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729

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Lixinc

USA . 19,456 parts In-Stock

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Corphita

USA . 1,164 parts In-Stock

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Microchip USA

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Overview

Get ready to experience top-notch performance and reliability with the LM3S5R31-IQC80-C1 microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This microcontroller is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Whether you're looking to streamline your processes or enhance your product's capabilities, the LM3S5R31-IQC80-C1 is the solution you've been searching for. Trust Texas Instruments to provide you with the quality and innovation you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easier and more efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

Provides a stable power source for the microcontroller, preventing it from getting damaged due to overvoltage.

Package Shape: SQUARE

Helps in efficient space utilization on the circuit board, allowing for a compact design.

Bit Size: 32

Offers a high level of processing power and capability, suitable for handling complex tasks and calculations.

No. of Terminals: 100

Provides sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Facilitates easy mounting and soldering onto the circuit board, ensuring a secure connection.

Minimum Supply Voltage: 1.08 V

Ensures that the microcontroller operates reliably even at lower voltage levels, avoiding potential malfunctions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be encountered, ensuring stable performance.

ADC Channels: YES

Allows the microcontroller to interface with analog sensors and devices, expanding its capabilities for data acquisition.

DMA Channels: YES

Enables efficient data transfer and processing, enhancing the overall performance of the microcontroller.

Terminal Position: QUAD

Provides a standardized layout for easy integration into circuit designs, improving compatibility and ease of use.

Maximum Seated Height: 1.6 mm

Maintains a low profile for the microcontroller, allowing for compact and slim device designs.

Width: 14 mm

Offers a compact form factor, suitable for space-constrained applications and circuit board layouts.

Maximum Clock Frequency: 0.032 MHz

Provides high-speed processing capabilities, enabling quick execution of instructions and tasks.

Length: 14 mm

Compact dimensions allow for flexibility in design and integration, suitable for various applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments, ensuring consistent performance under challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and control, enhancing overall performance and responsiveness.

Technology: CMOS

Offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: GULL WING

Provides secure and reliable connections on the circuit board, reducing the risk of disconnection or signal loss.

Nominal Supply Voltage: 1.2 V

Provides a stable operating voltage for the microcontroller, ensuring consistent and reliable performance.

PWM Channels: YES

Allows for precise control of output signals, making the microcontroller suitable for applications requiring accurate modulation.

ROM Programmability: FLASH

Enables flexible and easy programming of the microcontroller's memory, allowing for quick updates and modifications to the firmware.

Terminal Pitch: 0.5 mm

Offers a standardized pitch for easy integration into circuit board designs, ensuring compatibility and ease of assembly.

Speed: 80 rpm

Provides high processing speed and performance, suitable for applications requiring rapid data processing and response times.

No. of I/O Lines: 67

Offers a sufficient number of input/output connections for interfacing with external devices and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers LM3S5R31-IQC80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5R31-IQC80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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