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LM3S5P51-IQC80-C1

Texas Instruments

LM3S5P51-IQC80-C1 by Texas Instruments

Texas Instruments' LM3S5P51-IQC80-C1 is a 32-bit microcontroller with 100 terminals, operating at a max frequency of 0.032 MHz. Ideal for industrial applications, it features ADC and DMA channels, along with PWM support. With a compact square package style and low supply voltage requirements, it offers high performance in a small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,679 parts In-Stock

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8,679

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Digiode

USA . 1,866 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 208 parts In-Stock

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$12.949

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208

$12.949

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Parana Technologies

USA . 1,565 parts In-Stock

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$20.204

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$20.173

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$20.173

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DigiPath Technology Company

USA . 95 parts In-Stock

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$22.247

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95

$22.247

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ChromeModa Solutions

Germany . 4,872 parts In-Stock

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$22.701

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$18.615

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4,872

$22.701

$18.615

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IDEA Electronic Components Group

UK . 69 parts In-Stock

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$22.701

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$21.566

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$20.431

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69

$22.701

$21.566

$20.431

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One Stop Electronics

USA . 923 parts In-Stock

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$32.000

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923

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Corphita

USA . 1,890 parts In-Stock

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Microchip USA

USA . 121 parts In-Stock

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Kepictronics

USA . 84 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S5P51-IQC80-C1 by Texas Instruments, a top-of-the-line microcontroller designed for cutting-edge applications. With a reputation for excellence, Texas Instruments delivers unmatched quality and reliability in every product. This microcontroller is perfect for a wide range of uses, from industrial automation to consumer electronics. Offering superior performance and efficiency, the LM3S5P51-IQC80-C1 provides customers with the value and benefits they need to stay ahead in today's fast-paced market. Experience the advantages of this advanced technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration and space-saving on PCBs, making it suitable for compact designs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage provides flexibility in power supply options and compatibility with different voltage sources.

Package Shape: SQUARE

The square package shape ensures efficient use of board space and easy alignment during assembly.

Bit Size: 32

A 32-bit architecture offers higher processing capability and precision compared to lower bit sizes, suitable for handling complex tasks.

No. of Terminals: 100

Having a higher number of terminals allows for greater connectivity and integration with other components in the system.

Package Style (Meter): FLATPACK

The flatpack style provides a low profile design, suitable for applications where space constraints are a concern.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage helps to minimize power consumption and extend battery life in battery-operated devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and industrial settings.

ADC Channels: YES

Having ADC channels enables analog to digital conversion, essential for interfacing with sensors and measuring analog signals.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers secure and stable connections, reducing the risk of signal loss or interference.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a compact overall design, ideal for applications with limited vertical space.

Width: 14 mm

Compact width dimension facilitates easy PCB layout and integration into small form factor devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency allows for fast data processing and efficient operation of the microcontroller.

Length: 14 mm

The compact length dimension helps in fitting the microcontroller into tight spaces or small enclosures.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed for embedded systems and control applications, offering integrated peripherals and processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in operation.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and secure connections to the PCB, enhancing the product's reliability and durability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage for the microcontroller, ensuring consistent performance.

PWM Channels: YES

Having PWM channels allows for precise control of analog signals, essential for applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in programming and updating firmware, allowing for easy customization and future-proofing of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting on the PCB, conserving space and facilitating a compact design.

Speed: 80 rpm

With a speed of 80 rpm, the microcontroller can efficiently process instructions and data, meeting the demands of various applications.

No. of I/O Lines: 67

Having a high number of I/O lines allows for versatile interfacing with external devices, sensors, and peripherals, enhancing the product's connectivity and functionality.

Technical Specifications

Microcontrollers LM3S5P51-IQC80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5P51-IQC80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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