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LM3S5P3B-IQC80-C5T

Texas Instruments

LM3S5P3B-IQC80-C5T by Texas Instruments

Texas Instruments LM3S5P3B-IQC80-C5T is a 32-bit microcontroller with Cortex-M3 CPU, 67 I/O lines, and 16.384 MHz clock frequency. Ideal for industrial applications, it features ADC and DMA channels, along with FLASH ROM programmability for efficient performance in temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,595 parts In-Stock

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3,595

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Digiode

USA . 3,246 parts In-Stock

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3,246

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Distributors (Availability)

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One Stop Electronics

USA . 230 parts In-Stock

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$2.000

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230

$2.000

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AZTECH Wire

Italy . 616 parts In-Stock

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$17.189

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616

$17.189

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Parana Technologies

USA . 1,272 parts In-Stock

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$70.822

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$70.822

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ChromeModa Solutions

Germany . 5,793 parts In-Stock

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$79.575

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$65.252

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5,793

$79.575

$65.252

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IDEA Electronic Components Group

UK . 220 parts In-Stock

1+ parts

$79.575

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$75.596

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$71.618

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220

$79.575

$75.596

$71.618

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QUARKTWIN TECHNOLOGY LTD

USA . 20,914 parts In-Stock

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20,914

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Microchip USA

USA . 7,559 parts In-Stock

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Corphita

USA . 942 parts In-Stock

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942

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DigiPath Technology Company

USA . 25 parts In-Stock

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$71.745

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25

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$71.745

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Overview

Discover the LM3S5P3B-IQC80-C5T by Texas Instruments, a top-quality microcontroller designed to meet your unique application needs. With its advanced technology and reliable performance, this product delivers exceptional value and benefits to customers seeking innovative solutions. Whether you're working on industrial automation, IoT devices, or consumer electronics, this microcontroller with 32-bit processing power and numerous features like ADC channels, DMA channels, and PWM channels will help you achieve your goals efficiently. Trust Texas Instruments for cutting-edge technology that brings your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mountability allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.365 V

Efficient power consumption and compatibility with low voltage applications.

Bit Size: 32

Higher bit size allows for processing larger data and executing complex algorithms efficiently.

Power Supplies (V): 1.3,3.3

Support for multiple power supply options gives flexibility in voltage requirements of the system.

No. of Terminals: 100

Sufficient number of terminals for connecting various external components and peripherals.

ROM Words: 65536

Large ROM capacity allows for storing program code and data for advanced applications.

RAM Bytes: 24576

Adequate RAM size for data storage and processing, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 16.384 MHz

High clock frequency enables fast execution of instructions and operations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and integrated peripherals provide efficient performance and versatile functionality.

Technical Specifications

Microcontrollers LM3S5P3B-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5P3B-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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