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LM3S5P36-IQR80-C3T

Texas Instruments

LM3S5P36-IQR80-C3T by Texas Instruments

LM3S5P36-IQR80-C3T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a supply voltage range of 3V to 3.6V. The package style is flatpack with a square shape and Gull Wing terminal form, making it ideal for compact designs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,412 parts In-Stock

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Digiode

USA . 376 parts In-Stock

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376

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Distributors (Availability)

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Parana Technologies

USA . 106 parts In-Stock

1+ parts

$16.848

100+ parts

-

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$17.091

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106

$16.848

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$17.091

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One Stop Electronics

USA . 1,500 parts In-Stock

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$17.000

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$17.000

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DigiPath Technology Company

USA . 495 parts In-Stock

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$18.551

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$17.067

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495

$18.551

$17.067

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ChromeModa Solutions

Germany . 3,329 parts In-Stock

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$18.930

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$15.523

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3,329

$18.930

$15.523

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IDEA Electronic Components Group

UK . 2,061 parts In-Stock

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$18.930

100+ parts

$17.984

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$17.037

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2,061

$18.930

$17.984

$17.037

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AZTECH Wire

Italy . 282 parts In-Stock

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$19.000

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282

$19.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,793 parts In-Stock

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Corphita

USA . 3,432 parts In-Stock

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Microchip USA

USA . 3,093 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the LM3S5P36-IQR80-C3T by Texas Instruments. As a leading manufacturer in microcontrollers, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering high-speed performance and advanced features like ADC and DMA channels. With a compact design and industrial-grade temperature tolerance, this microcontroller is a powerhouse in a small package. Experience the value and benefits of Texas Instruments' LM3S5P36-IQR80-C3T for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space, making the microcontroller suitable for compact designs.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, allowing for faster and more complex operations.

No. of Terminals: 64

Higher number of terminals offer versatility in connectivity options, enabling integration with various peripherals and sensors.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and reliable connections, ensuring stable performance of the microcontroller.

ADC Channels: YES

ADC channels enable analog to digital conversion, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

DMA channels support direct memory access, enhancing data transfer efficiency and freeing up the CPU for other tasks.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz offers fast processing speed, making the microcontroller suitable for applications requiring rapid data processing.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this product offers integrated peripherals and processing capabilities, simplifying system design and reducing component count.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for firmware updates and easy customization, ensuring the microcontroller can adapt to changing requirements.

Technical Specifications

Microcontrollers LM3S5P36-IQR80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5P36-IQR80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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