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LM3S5P31-IQC80-C5T

Texas Instruments

LM3S5P31-IQC80-C5T by Texas Instruments

LM3S5P31-IQC80-C5T by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, 16 MHz clock frequency, and 24576 bytes of RAM. Ideal for industrial applications, it operates b/w -40 to 85°C and features ADC and DMA channels for efficient data processing. With a compact square package style and low supply current of 129 mA at a nominal voltage of 3.3 V, this microcontroller offers high performance in a small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,534 parts In-Stock

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2,534

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Vyrian

USA . 2,368 parts In-Stock

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2,368

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 667 parts In-Stock

1+ parts

$1.000

100+ parts

-

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667

$1.000

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AZTECH Wire

Italy . 817 parts In-Stock

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$14.118

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817

$14.118

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Parana Technologies

USA . 9 parts In-Stock

1+ parts

$32.209

100+ parts

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$102.341

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9

$32.209

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$102.341

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IDEA Electronic Components Group

UK . 1,309 parts In-Stock

1+ parts

$36.190

100+ parts

$34.380

1k+ parts

$32.571

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1,309

$36.190

$34.380

$32.571

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ChromeModa Solutions

Germany . 129 parts In-Stock

1+ parts

$36.190

100+ parts

$29.676

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129

$36.190

$29.676

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Corphita

USA . 2,790 parts In-Stock

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2,790

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DigiPath Technology Company

USA . 641 parts In-Stock

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100+ parts

$32.629

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641

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$32.629

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Microchip USA

USA . 383 parts In-Stock

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383

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Overview

Unleash the power of innovation with the LM3S5P31-IQC80-C5T by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-notch quality and reliability in every product. Ideal for a wide range of applications, this microcontroller offers unmatched performance and efficiency. Experience seamless integration, enhanced functionality, and streamlined operations with this cutting-edge solution. Elevate your projects to new heights with the LM3S5P31-IQC80-C5T and discover endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for use in different applications.

Surface Mount: YES

Surface mount technology allows for easy and quick installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the microcontroller, accommodating a wide range of power sources.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it ideal for compact designs.

Bit Size: 32

The 32-bit architecture provides higher processing power and performance compared to lower bit sizes, enabling the microcontroller to handle complex tasks efficiently.

Power Supplies (V): 1.3,3.3

Multiple power supply options allow for flexibility in voltage selection based on specific application requirements, enhancing compatibility.

No. of Terminals: 100

The large number of terminals provides ample connectivity options for interfacing with external components, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, making it suitable for space-constrained applications where height limitations are a concern.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function reliably in harsh environmental conditions, ensuring stable performance in extreme cold temperatures.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides high-performance processing capabilities, making the microcontroller suitable for demanding applications that require efficient computation.

Technical Specifications

Microcontrollers LM3S5P31-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5P31-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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