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LM3S5P31-IQC80-C5

Texas Instruments

LM3S5P31-IQC80-C5 by Texas Instruments

LM3S5P31-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, 16 MHz clock frequency, and 24576 bytes of RAM. Ideal for industrial applications, it operates b/w -40 to 85°C and features ADC and DMA channels for efficient data processing. With a compact square package style and low power consumption at a max of 129 mA, this microcontroller is suitable for various embedded systems requiring high performance in a small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,030 parts In-Stock

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Digiode

USA . 1,418 parts In-Stock

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AZTECH Wire

Italy . 411 parts In-Stock

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$11.254

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One Stop Electronics

USA . 875 parts In-Stock

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$21.000

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Parana Technologies

USA . 576 parts In-Stock

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$75.738

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DigiPath Technology Company

USA . 2,010 parts In-Stock

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$83.397

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$76.725

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ChromeModa Solutions

Germany . 2,912 parts In-Stock

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$85.099

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$69.781

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IDEA Electronic Components Group

UK . 2,173 parts In-Stock

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$85.099

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$80.844

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$76.589

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Component Stockers USA

USA . 283 parts In-Stock

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$99.990

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Lixinc

USA . 9,752 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 1,499 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Unleash the power of innovation with the LM3S5P31-IQC80-C5 microcontroller by Texas Instruments. Designed with cutting-edge technology and high-quality materials, this device offers unmatched performance in a compact package. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller boasts a 32-bit CPU family and advanced features such as ADC and DMA channels. Experience seamless operation and efficient processing with this versatile and reliable product, setting new standards in the industry. Elevate your projects with the LM3S5P31-IQC80-C5 microcontroller and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package durable and lightweight, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a safe voltage range, providing stability and reliability.

Package Shape: SQUARE

Square package shape provides efficient use of space on the circuit board.

Bit Size: 32

32-bit architecture offers higher processing capabilities and performance.

Power Supplies (V): 1.3,3.3

Support for multiple power supply voltages allows for flexibility in different applications.

No. of Terminals: 100

Having 100 terminals enables connectivity to various external components for enhanced functionality.

Package Style (Meter): FLATPACK

Flatpack style package provides a low profile design, suitable for compact devices.

Minimum Supply Voltage: 3 V

Provides a stable operation even at lower supply voltages, ensuring reliability.

Maximum Operating Temperature: 85 °C

Can operate at higher temperatures, suitable for industrial environments.

CPU Family: CORTEX-M3

Part of the Cortex-M3 family known for its efficient and high-performance microcontroller designs.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for a wide range of environments.

ADC Channels: YES

Built-in ADC channels allow for analog signal conversion, expanding the range of supported sensors.

DMA Channels: YES

DMA channels enhance data transfer speeds and efficiency, improving overall system performance.

Technical Specifications

Microcontrollers LM3S5P31-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5P31-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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