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LM3S5G56-IQR80-A2T

Texas Instruments

LM3S5G56-IQR80-A2T by Texas Instruments

LM3S5G56-IQR80-A2T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16.348 MHz. It features 65536 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring high-speed processing and precise analog-to-digital conversion capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,889 parts In-Stock

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5,889

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Digiode

USA . 1,913 parts In-Stock

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1,913

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Distributors (Availability)

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AZTECH Wire

Italy . 809 parts In-Stock

1+ parts

$6.587

100+ parts

-

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809

$6.587

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One Stop Electronics

USA . 617 parts In-Stock

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$35.000

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617

$35.000

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Parana Technologies

USA . 259 parts In-Stock

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$75.457

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259

$75.457

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IDEA Electronic Components Group

UK . 1,413 parts In-Stock

1+ parts

$84.783

100+ parts

$80.544

1k+ parts

$76.305

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-

1,413

$84.783

$80.544

$76.305

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ChromeModa Solutions

Germany . 696 parts In-Stock

1+ parts

$84.783

100+ parts

$69.522

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696

$84.783

$69.522

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Corphita

USA . 3,416 parts In-Stock

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3,416

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DigiPath Technology Company

USA . 786 parts In-Stock

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$76.440

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786

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$76.440

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Microchip USA

USA . 252 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S5G56-IQR80-A2T by Texas Instruments, a cutting-edge microcontroller that delivers unparalleled performance and reliability. Crafted by a renowned manufacturer, this device offers seamless integration and unmatched precision in a wide range of applications. Elevate your projects with the advanced features and top-notch quality of this microcontroller, providing you with the ultimate value and efficiency. Experience innovation at its finest with the LM3S5G56-IQR80-A2T and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the microcontroller, making it suitable for various applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle more data at a time, leading to improved performance and efficiency.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures high performance and low power consumption, making it ideal for embedded systems.

Maximum Clock Frequency: 16.348 MHz

The high clock frequency allows for fast processing of instructions, making this microcontroller suitable for applications requiring quick response times.

RAM Bytes: 65536

With a large RAM capacity, this microcontroller can handle complex calculations and data processing effectively.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing power, making this microcontroller a good choice for tasks that require high performance.

PWM Channels: YES

PWM channels allow for precise control of analog signals, making this microcontroller suitable for applications such as motor control and power management.

Technical Specifications

Microcontrollers LM3S5G56-IQR80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.348 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5G56-IQR80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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