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LM3S5D91-IQC80-A2

Texas Instruments

LM3S5D91-IQC80-A2 by Texas Instruments

Texas Instruments LM3S5D91-IQC80-A2 is a 32-bit microcontroller with Cortex-M3 CPU, 28-bit address bus, and 32-bit external data bus. It features 16-Ch 12-Bit ADCs, 72 I/O lines, and peripherals like CAN, USB, and UART. Ideal for industrial applications requiring high-speed processing at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,827 parts In-Stock

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Digiode

USA . 365 parts In-Stock

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365

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Distributors (Availability)

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AZTECH Wire

Italy . 735 parts In-Stock

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$18.762

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735

$18.762

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One Stop Electronics

USA . 1,239 parts In-Stock

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$24.000

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Parana Technologies

USA . 522 parts In-Stock

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$29.308

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$57.893

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522

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$57.893

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ChromeModa Solutions

Germany . 6,350 parts In-Stock

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$32.930

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$27.003

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6,350

$32.930

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IDEA Electronic Components Group

UK . 587 parts In-Stock

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$32.930

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$31.284

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$29.637

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587

$32.930

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$29.637

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Glotronic Ltd.

UK . 9,000 parts In-Stock

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Corphita

USA . 3,930 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,332 parts In-Stock

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DigiPath Technology Company

USA . 594 parts In-Stock

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$29.690

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Microchip USA

USA . 105 parts In-Stock

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Overview

Upgrade your projects with the LM3S5D91-IQC80-A2 by Texas Instruments, a top-quality microcontroller designed to deliver exceptional performance in a wide range of applications. With advanced features and reliable manufacturing from Texas Instruments, this microcontroller offers unbeatable value, benefits, and advantages to customers looking for a powerful solution. Experience seamless connectivity, high-speed operation, and versatile peripherals without compromising on quality. Take your designs to the next level with the LM3S5D91-IQC80-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller, ensuring long-term reliability.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers efficient processing capabilities, making this microcontroller suitable for a wide range of applications requiring moderate performance.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible updating of the microcontroller firmware, enabling adaptability to changing requirements.

ADC Channels: YES

The presence of Analog to Digital Converters (ADC) enables the microcontroller to interface with analog sensors and signals, expanding its range of potential applications.

Peripherals: BOD, COMPARATOR(2), DMA(32), POR, PWM(8), QEI(2), RTC, TIMER(5), WDT(2)

A wide range of peripherals such as Brown-Out Detector (BOD), Pulse Width Modulation (PWM), Real-Time Clock (RTC), timers, and more enhance the functionality and versatility of the microcontroller.

Connectivity: CAN(2), I2C(2), I2S, IRDA, LIN, MICROWIRE, SPI, SSI(2), UART(3), USB

Multiple connectivity options like CAN, UART, SPI, and USB facilitate communication with other devices, enabling seamless integration into various systems.

Technical Specifications

Microcontrollers LM3S5D91-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), I2S, IRDA, LIN, MICROWIRE, SPI, SSI(2), UART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(8), QEI(2), RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

LM3S5D91-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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