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LM3S5C36-IQR80-A2T

Texas Instruments

LM3S5C36-IQR80-A2T by Texas Instruments

LM3S5C36-IQR80-A2T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16.384 MHz. It features 65536 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,227 parts In-Stock

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Digiode

USA . 4,801 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 429 parts In-Stock

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$8.263

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One Stop Electronics

USA . 1,497 parts In-Stock

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$35.000

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Parana Technologies

USA . 1,081 parts In-Stock

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$45.863

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$45.863

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ChromeModa Solutions

Germany . 6,137 parts In-Stock

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$51.532

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$42.256

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6,137

$51.532

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IDEA Electronic Components Group

UK . 61 parts In-Stock

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$51.532

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$48.955

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$46.379

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61

$51.532

$48.955

$46.379

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QUARKTWIN TECHNOLOGY LTD

USA . 9,345 parts In-Stock

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Corphita

USA . 2,838 parts In-Stock

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DigiPath Technology Company

USA . 381 parts In-Stock

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$46.461

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Microchip USA

USA . 106 parts In-Stock

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Overview

Elevate your projects with the LM3S5C36-IQR80-A2T by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As part of the Microcontrollers category, this product offers unmatched value and versatility with applications ranging from industrial automation to consumer electronics. Experience seamless performance, advanced features, and cutting-edge technology in a compact and efficient package. Trust Texas Instruments to deliver innovation and excellence with the LM3S5C36-IQR80-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort in the assembly process.

Maximum Supply Voltage: 1.365 V

Efficient power consumption and compatibility with low voltage systems.

Package Shape: SQUARE

Compact design, optimizing space utilization on the circuit board.

Bit Size: 32

High processing capability for complex applications and tasks.

Power Supplies (V): 1.3, 3.3

Supports a variety of power supply options for flexibility in system integration.

No. of Terminals: 64

Sufficient connectivity options for interfacing with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Multiple packaging options for compatibility with different circuit board layouts and designs.

Minimum Supply Voltage: 1.235 V

Can operate efficiently at low voltage levels, saving power.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that require operation in high-temperature environments.

CPU Family: CORTEX-M3

High-performance Cortex-M3 processor architecture for fast and reliable processing.

Minimum Operating Temperature: -40 °C

Ideal for use in extreme cold environments without compromising performance.

ADC Channels: YES

Built-in Analog-to-Digital Converter for accurate analog signal processing.

DMA Channels: YES

Direct Memory Access support for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal configuration for versatile connectivity options.

ROM Words: 524288

Large Read-Only Memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained applications.

Width: 10 mm

Compact width for easy integration into various electronic devices.

Maximum Clock Frequency: 16.384 MHz

High clock frequency for fast processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a sufficient amount of time during manufacturing processes.

Peak Reflow Temperature °C: 260

Capable of enduring high reflow temperatures during soldering without damage.

Length: 10 mm

Compact length for space-saving integration in electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Integrated peripheral circuits and Reduced Instruction Set Computing architecture for optimized performance.

RAM Bytes: 65536

Sufficient Random Access Memory for temporary data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure connection to the circuit board.

Maximum Supply Current: 135 mA

Capable of supplying sufficient current for powering the microcontroller and connected peripherals.

Nominal Supply Voltage: 1.3 V

Stable and efficient nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation channels for precise control of connected devices.

ROM Programmability: FLASH

Flash memory for reprogrammability and flexibility in updating firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 for safe storage and handling in humid environments.

Speed: 80 rpm

Fast processing speed at 80 rotations per minute for efficient operation.

No. of I/O Lines: 33

Sufficient Input/Output lines for communication with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S5C36-IQR80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5C36-IQR80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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