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LM3S5956-IQR80-C5

Texas Instruments

LM3S5956-IQR80-C5 by Texas Instruments

Texas Instruments' LM3S5956-IQR80-C5 is a 32-bit microcontroller with Cortex-M3 CPU, 64 terminals, and 65536 RAM bytes. It operates b/w -40 to 85°C, has a max clock frequency of 16.348 MHz, and features ADC and DMA channels for industrial applications.

Median Price

$12.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 16 parts In-Stock

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$12.000

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$8.100

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Vyrian

USA . 3,287 parts In-Stock

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Digiode

USA . 318 parts In-Stock

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SPM Sales

USA . 70 parts In-Stock

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Dan-Mar Components

USA . 16 parts In-Stock

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AZTECH Wire

Italy . 355 parts In-Stock

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$5.276

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One Stop Electronics

USA . 232 parts In-Stock

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$23.000

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Parana Technologies

USA . 1,980 parts In-Stock

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$67.693

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ChromeModa Solutions

Germany . 5,218 parts In-Stock

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$76.059

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$62.368

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IDEA Electronic Components Group

UK . 158 parts In-Stock

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$76.059

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$72.256

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$68.453

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Corphita

USA . 2,597 parts In-Stock

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DigiPath Technology Company

USA . 846 parts In-Stock

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Microchip USA

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Overview

Elevate your projects with the LM3S5956-IQR80-C5 microcontroller from Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a powerful device that boasts a 32-bit Cortex-M3 CPU family. Perfect for applications requiring high performance and reliability, this microcontroller offers 64 terminals, PWM channels, ADC channels, and DMA channels, giving you the flexibility and capability you need. Whether you're working on industrial automation, consumer electronics, or automotive systems, this versatile microcontroller provides unmatched value, benefits, and advantages to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.365 V

Operates efficiently within a specified voltage range, ensuring proper functionality.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, optimizing layout design.

Bit Size: 32

A larger bit size allows for more complex processing and calculations, making it suitable for advanced applications.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options, providing flexibility in design and compatibility with various systems.

No. of Terminals: 64

Sufficient number of terminals for connecting to external components, peripherals, and power sources.

Maximum Operating Temperature: 85 °C

Ideal for industrial environments with higher operating temperatures, ensuring reliable performance under harsh conditions.

CPU Family: CORTEX-M3

Based on a popular and efficient CPU architecture, offering high performance and versatility.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, suitable for a wide range of applications and environments.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, enabling sensor interfacing and data acquisition.

DMA Channels: YES

Supports DMA for efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 262144

Large ROM size for storing program instructions and data, accommodating complex software requirements.

Maximum Clock Frequency: 16.348 MHz

High clock frequency for fast data processing and real-time operation, suitable for time-critical applications.

RAM Bytes: 65536

Sufficient RAM for temporary data storage and processing, facilitating multitasking and complex algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall energy efficiency.

Technical Specifications

Microcontrollers LM3S5956-IQR80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.348 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5956-IQR80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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