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LM3S5951-IQC80-C3T

Texas Instruments

LM3S5951-IQC80-C3T by Texas Instruments

Texas Instruments LM3S5951-IQC80-C3T is a 32-bit microcontroller with 100 terminals, operating at up to 16 MHz. Suitable for industrial applications, it features ADC and DMA channels, PWM support, and operates b/w -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,578 parts In-Stock

1+ parts

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5,578

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Digiode

USA . 4,186 parts In-Stock

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4,186

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$7.710

100+ parts

-

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558

$7.710

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One Stop Electronics

USA . 524 parts In-Stock

1+ parts

$26.000

100+ parts

-

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524

$26.000

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Parana Technologies

USA . 1,507 parts In-Stock

1+ parts

$63.495

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-

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1,507

$63.495

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DigiPath Technology Company

USA . 1,191 parts In-Stock

1+ parts

$69.916

100+ parts

$64.323

1k+ parts

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1,191

$69.916

$64.323

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ChromeModa Solutions

Germany . 2,111 parts In-Stock

1+ parts

$71.343

100+ parts

$58.501

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2,111

$71.343

$58.501

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IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$71.343

100+ parts

$67.776

1k+ parts

$64.209

10k+ parts

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249

$71.343

$67.776

$64.209

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Corphita

USA . 1,862 parts In-Stock

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1,862

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Microchip USA

USA . 231 parts In-Stock

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231

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Overview

Unlock the possibilities with the LM3S5951-IQC80-C3T by Texas Instruments, a top-of-the-line microcontroller designed to deliver superior performance and reliability. From industrial automation to consumer electronics, this cutting-edge device offers unmatched versatility and efficiency. With its advanced technology and high-quality construction, Texas Instruments ensures that you're getting the best value for your money. Experience seamless operation and endless opportunities with the LM3S5951-IQC80-C3T. Elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and resistance to external elements, ensuring a longer lifespan for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can safely operate within a wide range of power inputs.

Bit Size: 32

32-bit architecture provides enhanced processing power and efficiency, making it suitable for complex tasks and applications.

No. of Terminals: 100

Having 100 terminals allows for a wide range of connectivity options and interfaces, increasing flexibility in design and integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40°C to 85°C) ensures reliable performance in harsh environments and extended operating conditions.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz enables fast execution of instructions and high-speed data processing, suitable for time-sensitive applications.

Peripheral IC Type: MICROCONTROLLER

Microcontroller with integrated peripherals simplifies system design, reduces component count, and overall system cost.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, ensuring flexibility and scalability in application development.

Technical Specifications

Microcontrollers LM3S5951-IQC80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5951-IQC80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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