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LM3S5791-IQC80-C5T

Texas Instruments

LM3S5791-IQC80-C5T by Texas Instruments

Texas Instruments LM3S5791-IQC80-C5T is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 65536 RAM bytes. It operates at up to 80 MHz with 72 I/O lines, suitable for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,295 parts In-Stock

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6,295

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Digiode

USA . 3,352 parts In-Stock

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3,352

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Distributors (Availability)

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AZTECH Wire

Italy . 201 parts In-Stock

1+ parts

$9.447

100+ parts

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201

$9.447

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One Stop Electronics

USA . 1,564 parts In-Stock

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$12.000

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1,564

$12.000

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Parana Technologies

USA . 2,045 parts In-Stock

1+ parts

$13.603

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$14.102

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2,045

$13.603

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$14.102

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DigiPath Technology Company

USA . 2,198 parts In-Stock

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$14.978

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2,198

$14.978

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IDEA Electronic Components Group

UK . 2,300 parts In-Stock

1+ parts

$15.284

100+ parts

$14.520

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$13.756

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2,300

$15.284

$14.520

$13.756

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ChromeModa Solutions

Germany . 1,522 parts In-Stock

1+ parts

$15.284

100+ parts

$12.533

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1,522

$15.284

$12.533

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Corphita

USA . 4,847 parts In-Stock

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Microchip USA

USA . 426 parts In-Stock

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Overview

Unlock the potential of your projects with the LM3S5791-IQC80-C5T microcontroller by Texas Instruments. Built with precision and reliability, this Cortex-M3 CPU family device offers a wide range of applications in various industries. With advanced features like ADC and DMA channels, PWM capabilities, and high clock frequency, this microcontroller provides unmatched performance and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and experience the seamless integration and unparalleled value that the LM3S5791-IQC80-C5T brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring a long lifespan.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.32 V

Operates efficiently with a maximum supply voltage of 1.32 V, suitable for low power applications.

Package Shape: SQUARE

Square package shape provides a compact form factor, ideal for space-constrained designs.

Bit Size: 32

32-bit architecture offers high performance and processing capabilities for complex tasks.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options, allowing flexibility in different voltage requirements.

No. of Terminals: 100

Features a high number of terminals for connecting various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Offers versatile package styles for compatibility with different assembly configurations.

Minimum Supply Voltage: 1.08 V

Can operate at a low minimum supply voltage of 1.08 V, suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures up to 85°C, making it suitable for industrial environments.

CPU Family: CORTEX-M3

Utilizes the efficient ARM Cortex-M3 CPU architecture for reliable and fast processing capabilities.

Minimum Operating Temperature: -40 °C

Operates reliably even in extremely cold temperatures down to -40°C.

ADC Channels: YES

Integrated Analog-to-Digital Converter channels for precise analog signal measurements.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfers without CPU intervention.

Terminal Position: QUAD

Quad terminal position for easy and secure connection to external devices.

ROM Words: 131072

Large ROM capacity of 131,072 words for storing program code and data.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6 mm for slim and compact designs.

Width: 14 mm

Compact width of 14 mm for fitting into tight spaces on PCBs.

Maximum Clock Frequency: 80 MHz

High maximum clock frequency of 80 MHz for rapid data processing and execution speed.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds during soldering processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature tolerance of 260°C for reliable soldering connections.

Length: 14 mm

Compact length of 14 mm for space-saving design integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing.

RAM Bytes: 65536

Large RAM capacity of 65,536 bytes for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure solder connections and easy PCB mounting.

Maximum Supply Current: 129 mA

Low maximum supply current of 129 mA for energy-efficient operation.

Nominal Supply Voltage: 1.2 V

Nominal supply voltage of 1.2 V for stable and reliable performance.

PWM Channels: YES

Integrated Pulse Width Modulation (PWM) channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM programmability for easy and flexible firmware updates and storage.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm for high-density PCB layouts and connections.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 for safe handling and reflow processes.

Speed: 80 rpm

High processing speed of 80 revolutions per minute for rapid data processing.

No. of I/O Lines: 72

Multiple I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S5791-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5791-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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