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LM3S5762-IQR50-A0T

Texas Instruments

LM3S5762-IQR50-A0T by Texas Instruments

LM3S5762-IQR50-A0T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 0.032 MHz. It features 131072 ROM words, 65536 RAM bytes, and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,703 parts In-Stock

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3,703

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Digiode

USA . 3,617 parts In-Stock

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3,617

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Distributors (Availability)

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$12.344

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755

$12.344

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One Stop Electronics

USA . 365 parts In-Stock

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$15.000

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365

$15.000

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Microchip USA

USA . 3,743 parts In-Stock

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$28.180

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$27.780

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$27.580

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$27.380

3,743

$28.180

$27.780

$27.580

$27.380

Parana Technologies

USA . 1,376 parts In-Stock

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$52.580

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DigiPath Technology Company

USA . 737 parts In-Stock

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$57.897

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$53.266

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737

$57.897

$53.266

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IDEA Electronic Components Group

UK . 1,734 parts In-Stock

1+ parts

$59.079

100+ parts

$56.125

1k+ parts

$53.171

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1,734

$59.079

$56.125

$53.171

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ChromeModa Solutions

Germany . 737 parts In-Stock

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$59.079

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$48.445

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737

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$48.445

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QUARKTWIN TECHNOLOGY LTD

USA . 4,696 parts In-Stock

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Corphita

USA . 374 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments LM3S5762-IQR50-A0T microcontroller. Crafted with precision and expertise by a leading manufacturer in the industry, this powerful device offers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile product caters to a wide range of applications. Experience seamless integration and exceptional value with the LM3S5762-IQR50-A0T, where innovation meets excellence. Elevate your projects and unleash your creativity with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good thermal conductivity and insulation properties.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into electronic devices.

Maximum Supply Voltage: 2.75 V

This voltage level is suitable for many low-power applications, making the microcontroller versatile.

Bit Size: 32

A 32-bit architecture allows for more complex calculations and faster processing speeds compared to lower bit sizes.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for flexibility in different application scenarios.

No. of Terminals: 64

Having a higher number of terminals provides more options for connecting peripherals and external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving design for efficient board layout.

Maximum Operating Temperature: 85 °C

The microcontroller can operate effectively in environments with higher temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, the microcontroller can withstand harsh conditions without performance degradation.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and a durable surface for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels allow the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position offers better stability and mechanical support during mounting and soldering processes.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store program instructions and data efficiently.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6 mm enables thinner and more compact electronic devices.

Width: 10 mm

Compact width dimension allows for space-efficient board layout and integration.

Maximum Clock Frequency: 0.032 MHz

Higher clock frequency enables faster processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for up to 30 seconds during soldering processes.

Peak Reflow Temperature °C: 260

The microcontroller can endure high peak reflow temperatures during soldering without damage.

Length: 10 mm

Compact length dimension helps in reducing the overall size of the electronic device.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environments and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller enhances processing speed and efficiency, making it suitable for real-time applications.

RAM Bytes: 65536

The microcontroller has sufficient RAM capacity for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connection and ease of soldering during PCB assembly.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog output signals for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the microcontroller's firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and space optimization on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller has moderate sensitivity to moisture during storage and handling.

Speed: 50 rpm

High speed of 50 rpm facilitates quick data processing and execution of tasks.

No. of I/O Lines: 33

Having 33 I/O lines provides ample connectivity options to interface with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S5762-IQR50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5762-IQR50-A0T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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