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LM3S5752-IQR50-A0T

Texas Instruments

LM3S5752-IQR50-A0T by Texas Instruments

LM3S5752-IQR50-A0T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 0.032 MHz. It features 131072 ROM words and 65536 RAM bytes, suitable for industrial applications requiring a CPU family of CORTEX-M3 and peripheral IC type of MICROCONTROLLER, RISC.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,086 parts In-Stock

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4,086

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Digiode

USA . 845 parts In-Stock

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845

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Distributors (Availability)

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One Stop Electronics

USA . 621 parts In-Stock

1+ parts

$12.000

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621

$12.000

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AZTECH Wire

Italy . 838 parts In-Stock

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$15.909

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838

$15.909

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Parana Technologies

USA . 2,160 parts In-Stock

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$23.325

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$23.966

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2,160

$23.325

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$23.966

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ChromeModa Solutions

Germany . 6,336 parts In-Stock

1+ parts

$26.208

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$21.491

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6,336

$26.208

$21.491

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IDEA Electronic Components Group

UK . 61 parts In-Stock

1+ parts

$26.208

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$24.898

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$23.587

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61

$26.208

$24.898

$23.587

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Microchip USA

USA . 2,477 parts In-Stock

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Corphita

USA . 1,343 parts In-Stock

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DigiPath Technology Company

USA . 1,268 parts In-Stock

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$23.629

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1,268

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$23.629

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Overview

Elevate your projects with the LM3S5752-IQR50-A0T microcontroller from Texas Instruments, a trusted manufacturer known for top-quality components. Designed for a wide range of applications, this 32-bit powerhouse offers unparalleled performance and reliability. With a combination of cutting-edge technology and user-friendly features, this microcontroller provides exceptional value to customers looking to bring their ideas to life. Explore endless possibilities and unlock new opportunities with the LM3S5752-IQR50-A0T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and provides excellent protection for the microcontroller components.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications and helps prevent damage from voltage spikes.

Package Shape: SQUARE

Square shape makes it easier to place and secure on the circuit board.

Bit Size: 32

Provides high processing capabilities and allows for complex functions to be carried out efficiently.

Power Supplies (V): 2.5,3.3

Offers flexibility in power options, accommodating different voltage requirements for various applications.

No. of Terminals: 64

Sufficient number of terminals for connecting to other components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style is suitable for applications where space is limited and a low profile is desired.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

CPU Family: CORTEX-M3

A powerful and efficient CPU family known for its performance and low power consumption.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it versatile for various environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures reliable connections.

ADC Channels: YES

Analog-to-digital converter channels allow for connecting to analog sensors and inputs.

Terminal Position: QUAD

Quad terminal position provides stable mechanical support and ease of soldering.

ROM Words: 131072

Large ROM storage capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for applications with space constraints.

Width: 10 mm

Compact width for easy integration into circuit board layouts.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during soldering process without affecting performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust manufacturing processes.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for fast and efficient processing of instructions.

RAM Bytes: 65536

Generous amount of RAM for temporary data storage during processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure connections.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels for controlling power outputs and precise signal generation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Narrow terminal pitch for compact layout and increased terminal density.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity level.

Speed: 50 rpm

Capable of high processing speed for demanding applications.

No. of I/O Lines: 33

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S5752-IQR50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5752-IQR50-A0T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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