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LM3S5749-IQC50-A0T

Texas Instruments

LM3S5749-IQC50-A0T by Texas Instruments

LM3S5749-IQC50-A0T by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family, 131072 ROM words, and 65536 RAM bytes. It features 8-channel 10-bit ADC, CAN(2), I2C(2), SSI(2), UART(2), USB connectivity, and low power mode for industrial applications. With a max clock frequency of 0.032 MHz and integrated cache, it offers high performance in a compact square package style.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,958 parts In-Stock

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Vyrian

USA . 3,218 parts In-Stock

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3,218

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Chip Stock

USA . 275 parts In-Stock

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275

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One Stop Electronics

USA . 705 parts In-Stock

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$2.000

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705

$2.000

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AZTECH Wire

Italy . 843 parts In-Stock

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$18.560

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Parana Technologies

USA . 259 parts In-Stock

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$38.963

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DigiPath Technology Company

USA . 311 parts In-Stock

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$42.903

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IDEA Electronic Components Group

UK . 2,047 parts In-Stock

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$43.779

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$41.590

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$39.401

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2,047

$43.779

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$39.401

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ChromeModa Solutions

Germany . 63 parts In-Stock

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$43.779

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$35.899

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63

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$35.899

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Microchip USA

USA . 2,669 parts In-Stock

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$55.430

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$54.640

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$54.240

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$53.850

2,669

$55.430

$54.640

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$53.850

Lixinc

USA . 13,300 parts In-Stock

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Corphita

USA . 3,109 parts In-Stock

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Overview

Unlock the full potential of your next project with the LM3S5749-IQC50-A0T microcontroller by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Perfect for a wide range of applications, this microcontroller offers unmatched performance and efficiency. Experience seamless connectivity, advanced peripherals, and low power consumption all in one device. Trust Texas Instruments to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microcontroller by reducing access time to frequently used instructions and data.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protection of the microcontroller from overvoltage conditions.

On Chip Data RAM Width: 8

With a data RAM width of 8, the microcontroller can efficiently handle and process data in 8-bit chunks, optimizing data manipulation operations.

Package Shape: SQUARE

The square package shape provides a uniform layout for easy integration into circuit designs, saving space and ensuring a more compact overall system.

Bit Size: 32

Having a 32-bit architecture allows the microcontroller to process larger and more complex data sets, enabling high-performance computing capabilities.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in powering the microcontroller based on specific application requirements.

No. of Terminals: 100

The 100 terminals provide a sufficient number of connection points for interfacing with external components, ensuring versatility and connectivity in system design.

Package Style (Meter): FLATPACK

The flatpack package style offers ease of mounting and soldering onto PCBs, simplifying the assembly process and enhancing overall reliability.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V allows the microcontroller to operate efficiently even at lower voltage levels, conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand high-temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family ensures high performance, low power consumption, and scalability, making it an excellent choice for embedded applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows the microcontroller to function reliably in cold climates or harsh environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a corrosion-resistant surface, ensuring long-term reliability and robustness in various operating environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, facilitating interfacing with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position offers stable and secure mounting on the PCB, enhancing mechanical strength and ensuring reliable connections.

ROM Words: 131072

The large ROM capacity of 131072 words allows for storing a significant amount of program instructions and data, supporting complex applications and algorithms.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm enables the microcontroller to be used in slim or space-constrained designs, providing greater flexibility in product development.

Width: 14 mm

Having a width of 14 mm ensures compatibility with standard PCB layouts and spacing requirements, making integration into existing designs easier.

Boundary Scan: YES

Support for boundary scan testing allows for easier debugging, testing, and verification of the microcontroller's functionality, improving overall product quality and reliability.

Peripherals: DMA(32), TIMER(4), WDT

The presence of multiple peripherals such as DMA controllers, timers, and watchdog timers enhances the microcontroller's capabilities for multitasking, timekeeping, and system monitoring.

Maximum Clock Frequency: 0.032 MHz

The maximum clock frequency of 0.032 MHz enables fast processing of instructions and data, contributing to high performance and efficiency in computation tasks.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow temperature time of 30 seconds, the microcontroller can undergo reliable soldering processes without thermal damage, ensuring proper assembly and functionality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for robust solder joint formation during the assembly process, ensuring long-term mechanical and electrical integrity.

Length: 14 mm

With a length of 14 mm, the microcontroller has a compact form factor suitable for space-constrained applications, while still offering high processing capabilities.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures the microcontroller's reliability and performance under extreme temperature conditions typically found in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller's RISC-based architecture and peripheral integration provide efficient operation, high-speed execution, and reduced power consumption, making it ideal for a wide range of applications.

No. of Timers: 4

Having 4 timers allows for precise timing control and event scheduling, enabling the microcontroller to manage various tasks concurrently and efficiently.

RAM Bytes: 65536

The large RAM capacity of 65536 bytes provides ample space for storing and manipulating data during program execution, supporting complex algorithms and data processing tasks.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and suitable for battery-powered applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints and excellent mechanical stability, enhancing the microcontroller's reliability and performance in demanding environments.

Analog To Digital Convertors: 8-Ch 10-Bit

Having 8 channels and 10-bit resolution for analog-to-digital conversion enables the microcontroller to interface with multiple analog sensors or signals and process them accurately.

Maximum Supply Current: 25 mA

The maximum supply current of 25 mA ensures efficient power usage and prevents the microcontroller from drawing excessive current, enhancing energy efficiency and system reliability.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a stable operating voltage for the microcontroller, ensuring consistent performance and reliability in various operating conditions.

No. of DMA Channels: 32

Having 32 Direct Memory Access (DMA) channels allows for efficient data transfer between peripherals and memory, reducing CPU overhead and improving overall system performance.

No. of Serial I/Os: 3

With 3 serial I/Os, the microcontroller can communicate with multiple external devices simultaneously, enabling efficient data exchange and control in interconnected systems.

PWM Channels: YES

The presence of Pulse Width Modulation (PWM) channels allows for precise control of analog signals, making the microcontroller suitable for tasks like motor control, lighting regulation, and signal modulation.

Connectivity: CAN(2), I2C(2), SSI(2), UART(2), USB

Support for various communication interfaces such as CAN, I2C, SSI, UART, and USB enables seamless connectivity with a wide range of external devices and peripherals, enhancing the microcontroller's versatility and interoperability.

ROM Programmability: FLASH

The use of flash memory for ROM programmability allows for easy and efficient reprogramming of the microcontroller's firmware, facilitating firmware updates, debugging, and customization.

Technical Specifications

Microcontrollers LM3S5749-IQC50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

61

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SSI(2), UART(2), USB

Peripherals:

DMA(32), TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S5749-IQC50-A0T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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