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LM3S5749-IQC50-A0

Texas Instruments

LM3S5749-IQC50-A0 by Texas Instruments

Texas Instruments LM3S5749-IQC50-A0 microcontroller features 32-bit CPU, 131072 ROM words, and 65536 RAM bytes. Ideal for industrial applications with CAN, I2C, UART connectivity options. Operates at -40 to 85°C temperature range with low power mode and integrated cache for efficient performance.

Median Price

$24.450

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 90 parts In-Stock

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$24.450

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Vyrian

USA . 8,638 parts In-Stock

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Digiode

USA . 4,450 parts In-Stock

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4,450

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Chip Stock

USA . 275 parts In-Stock

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275

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Distributors (Availability)

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AZTECH Wire

Italy . 289 parts In-Stock

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$14.370

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289

$14.370

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Parana Technologies

USA . 817 parts In-Stock

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$51.098

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DigiPath Technology Company

USA . 1,506 parts In-Stock

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$56.266

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$51.764

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ChromeModa Solutions

Germany . 3,742 parts In-Stock

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$57.414

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$47.079

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3,742

$57.414

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IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$57.414

100+ parts

$54.543

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$51.673

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1,691

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$51.673

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Microchip USA

USA . 2,091 parts In-Stock

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$59.250

100+ parts

$58.220

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$57.700

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$57.190

2,091

$59.250

$58.220

$57.700

$57.190

Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Lixinc

USA . 4,624 parts In-Stock

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Corphita

USA . 2,223 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Unlock limitless possibilities with the Texas Instruments LM3S5749-IQC50-A0 microcontroller. Manufactured by a trusted industry leader, this high-quality device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this powerful microcontroller boasts integrated cache, low power mode, and a variety of peripherals for seamless connectivity. Experience the value and benefits of cutting-edge technology with the LM3S5749-IQC50-A0 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microcontroller lightweight and durable, ideal for portable and rugged applications.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by storing frequently accessed data and instructions, resulting in faster execution times.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures compatibility with a wide range of power sources, making it versatile and easy to use in different projects.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family, this microcontroller offers high performance and efficiency, making it suitable for a variety of applications including IoT, industrial automation, and consumer electronics.

ROM Words: 131072

With a ROM capacity of 131072 words, this microcontroller can store a large amount of program data, enabling complex algorithms and applications to be implemented efficiently.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, making it suitable for applications requiring analog data processing.

Connectivity: CAN(2), I2C(2), SSI(2), UART(2), USB

The multiple connectivity options including CAN, I2C, UART, and USB enable seamless communication with other devices and systems, enhancing the versatility and connectivity of the microcontroller.

Technical Specifications

Microcontrollers LM3S5749-IQC50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

61

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SSI(2), UART(2), USB

Peripherals:

DMA(32), TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S5749-IQC50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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