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LM3S5747-IQC50-A0

Texas Instruments

LM3S5747-IQC50-A0 by Texas Instruments

Texas Instruments LM3S5747-IQC50-A0 microcontroller features 32-bit CPU, 131072 ROM words, and 65536 RAM bytes. Ideal for industrial applications with CAN, I2C, UART connectivity options. Operates b/w -40 to 85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,140 parts In-Stock

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Digiode

USA . 1,577 parts In-Stock

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1,577

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Distributors (Availability)

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AZTECH Wire

Italy . 806 parts In-Stock

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$10.193

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806

$10.193

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One Stop Electronics

USA . 748 parts In-Stock

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$27.000

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748

$27.000

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Parana Technologies

USA . 1,257 parts In-Stock

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$65.211

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DigiPath Technology Company

USA . 1,813 parts In-Stock

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$71.806

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$71.806

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ChromeModa Solutions

Germany . 3,280 parts In-Stock

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$73.271

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$60.082

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$73.271

$60.082

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IDEA Electronic Components Group

UK . 615 parts In-Stock

1+ parts

$73.271

100+ parts

$69.607

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$65.944

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615

$73.271

$69.607

$65.944

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 560 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

Germany . 165 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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Overview

Experience the pinnacle of performance and reliability with the LM3S5747-IQC50-A0 microcontroller by Texas Instruments. Crafted with precision and expertise, this versatile device opens up a world of possibilities in industrial applications, offering seamless connectivity through CAN, I2C, SSI, UART, and USB interfaces. With its low power mode and wide range of peripherals such as BOR, DMA, TIMER(3), and WDT, this microcontroller delivers unmatched efficiency and functionality. Trust in Texas Instruments to deliver cutting-edge technology that empowers you to innovate and excel. Elevate your projects with the LM3S5747-IQC50-A0 and experience exceptional quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and helps in protecting the internal components of the microcontroller, making it suitable for industrial use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage helps in minimizing power consumption and heat dissipation, making the microcontroller energy-efficient.

Package Shape: SQUARE

Square package shape provides uniformity in design and facilitates easier PCB layout and component placement.

Bit Size: 32

32-bit architecture enables the microcontroller to process data and perform tasks at a faster rate, making it suitable for applications requiring high computational power.

CPU Family: CORTEX-M3

CORTEX-M3 CPU family offers high performance and energy efficiency, making the microcontroller ideal for a wide range of embedded applications.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, making it versatile and suitable for sensor-based applications.

ROM Words: 131072

Large ROM size allows for storing a significant amount of program data and firmware, enabling the microcontroller to execute complex instructions and tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller's peripheral IC ensures efficient instruction execution and faster processing speed, enhancing overall performance.

Connectivity: CAN, I2C, SSI, UART, USB

Multiple connectivity options enable seamless integration with various external devices and communication protocols, making the microcontroller versatile and adaptable for diverse applications.

Technical Specifications

Microcontrollers LM3S5747-IQC50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

61

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI, UART, USB

Peripherals:

BOR, DMA, TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S5747-IQC50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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