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LM3S5737-IQC50-A0T

Texas Instruments

LM3S5737-IQC50-A0T by Texas Instruments

LM3S5737-IQC50-A0T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 65536 RAM bytes, and 61 I/O lines. It operates at a max clock frequency of 50 MHz and has PWM channels for various applications in industrial settings. With a temperature range from -40 to 85°C, it is suitable for diverse embedded systems requiring high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,151 parts In-Stock

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Digiode

USA . 1,656 parts In-Stock

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1,656

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Distributors (Availability)

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AZTECH Wire

Italy . 254 parts In-Stock

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$6.804

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254

$6.804

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$21.769

100+ parts

$19.810

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$17.851

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500

$21.769

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$17.851

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One Stop Electronics

USA . 259 parts In-Stock

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$29.000

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259

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Microchip USA

USA . 2,507 parts In-Stock

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$33.680

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$33.200

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$32.960

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$32.710

2,507

$33.680

$33.200

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$32.710

Parana Technologies

USA . 2,074 parts In-Stock

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$75.177

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$75.177

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IDEA Electronic Components Group

UK . 2,126 parts In-Stock

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$84.468

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$80.245

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$76.021

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2,126

$84.468

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$76.021

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ChromeModa Solutions

Germany . 755 parts In-Stock

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$84.468

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$69.264

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755

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Component Stockers USA

USA . 691 parts In-Stock

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$99.990

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Corphita

USA . 4,374 parts In-Stock

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DigiPath Technology Company

USA . 1,823 parts In-Stock

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$76.156

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Overview

Unleash the power of innovation with the LM3S5737-IQC50-A0T microcontroller by Texas Instruments. Designed with precision and quality in mind, this cutting-edge device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unparalleled value, efficiency, and versatility. Trust in Texas Instruments to provide the tools you need to bring your ideas to life. Elevate your projects with the LM3S5737-IQC50-A0T and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material ensures durability and resistance to damage, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability simplifies the installation process and allows for efficient use of PCB space.

Maximum Supply Voltage: 2.75 V

Operates effectively within a specified voltage range, ensuring stable performance.

Address Bus Width: 8

Wide address bus width allows for efficient memory addressing and data transfer.

Package Shape: SQUARE

Square package shape makes it easy to handle and mount on a circuit board.

Bit Size: 32

32-bit architecture provides improved computational capabilities and performance.

No. of Terminals: 100

Sufficient number of terminals for connecting various components and peripherals.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable operation in extreme environments.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing speeds and efficient operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design ensure efficient handling of instructions and tasks.

Technical Specifications

Microcontrollers LM3S5737-IQC50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

61

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5737-IQC50-A0T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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