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LM3S5662-IQR50-A0T

Texas Instruments

LM3S5662-IQR50-A0T by Texas Instruments

Texas Instruments LM3S5662-IQR50-A0T is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 32768 RAM bytes. Operating at -40 to 85°C, it features 33 I/O lines, PWM channels, and ADC channels for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,702 parts In-Stock

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4,702

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Digiode

USA . 2,188 parts In-Stock

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2,188

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$10.331

100+ parts

-

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841

$10.331

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One Stop Electronics

USA . 1,148 parts In-Stock

1+ parts

$24.000

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1,148

$24.000

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Microchip USA

USA . 2,134 parts In-Stock

1+ parts

$27.960

100+ parts

$27.560

1k+ parts

$27.360

10k+ parts

$27.160

2,134

$27.960

$27.560

$27.360

$27.160

Ampacity Inc.

Singapore . 1,086 parts In-Stock

1+ parts

$30.000

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1,086

$30.000

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Parana Technologies

USA . 1,639 parts In-Stock

1+ parts

$31.442

100+ parts

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$80.094

10k+ parts

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1,639

$31.442

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$80.094

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DigiPath Technology Company

USA . 132 parts In-Stock

1+ parts

$34.621

100+ parts

$31.852

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132

$34.621

$31.852

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ChromeModa Solutions

Germany . 3,490 parts In-Stock

1+ parts

$35.328

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$28.969

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3,490

$35.328

$28.969

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IDEA Electronic Components Group

UK . 119 parts In-Stock

1+ parts

$35.328

100+ parts

$33.562

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$31.795

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119

$35.328

$33.562

$31.795

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Corphita

USA . 1,493 parts In-Stock

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1,493

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Overview

Unlock the power of innovation with the LM3S5662-IQR50-A0T by Texas Instruments, a high-quality microcontroller designed to elevate your projects to new heights. Manufactured by the industry leader in cutting-edge technology, this device offers unmatched performance and reliability. With a wide range of applications in various industries, this microcontroller boasts a 32-bit CPU family with 131072 ROM words and 32768 RAM bytes, providing seamless operation and efficient processing. Take advantage of its advanced features, including PWM channels and ADC capabilities, to create dynamic and responsive systems. Trust in Texas Instruments to deliver excellence, and experience the difference with the LM3S5662-IQR50-A0T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing the weight of the microcontroller, making it suitable for portable devices.

Surface Mount: YES

Surface mount design allows for easy and compact integration of the microcontroller onto a PCB, saving space.

Maximum Supply Voltage: 2.75 V

Lower maximum supply voltage helps in reducing power consumption and heat generation, ideal for energy-efficient applications.

Package Shape: SQUARE

Square package shape ensures uniformity in size and easy placement on the PCB, simplifying the manufacturing process.

Bit Size: 32

32-bit architecture provides higher processing power and more memory addressability, suitable for handling complex tasks efficiently.

Power Supplies (V): 2.5,3.3

Multiple power supply options allow flexibility in design and compatibility with different voltage requirements of components in the system.

No. of Terminals: 64

Higher number of terminals provides more I/O functionalities and connectivity options, making it versatile for various applications.

Minimum Supply Voltage: 2.25 V

Lower minimum supply voltage ensures stable operation even in low power supply conditions, enhancing the reliability of the microcontroller.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance enables the microcontroller to withstand harsh environmental conditions, suitable for industrial applications.

CPU Family: CORTEX-M3

Based on the Cortex-M3 architecture which offers high performance and energy efficiency, making it an ideal choice for embedded systems.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme cold conditions, suitable for outdoor or automotive applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and corrosion resistance, ensuring long-term reliability of the connections.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion, expanding the range of sensors and actuators that can be interfaced with the microcontroller.

Terminal Position: QUAD

Quad terminal position allows for easier and more secure soldering and connection, improving the reliability of the PCB assembly.

ROM Words: 131072

Large ROM capacity allows for storing a vast amount of program and data, suitable for applications requiring extensive memory storage.

Maximum Seated Height: 1.6 mm

Low seated height enables compact and slim design of the PCB, allowing for thinner devices and efficient use of space.

Width: 10 mm

Compact width dimension facilitates space-saving integration on the PCB layout, ideal for miniaturized electronic devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency provides fast processing speed and responsiveness, suitable for real-time applications with stringent timing requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and bonding during the assembly process, enhancing the reliability of the connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with lead-free soldering processes and reliability in high-temperature environments.

Length: 10 mm

Compact length dimension allows for efficient use of space on the PCB, contributing to a more streamlined and sleek electronic device design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance with simplified instruction set, enabling fast and efficient execution of tasks in embedded systems.

RAM Bytes: 32768

Large RAM capacity allows for temporary data storage and multitasking capabilities, essential for handling complex algorithms and processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance in harsh conditions.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, maintaining performance and functionality over time.

PWM Channels: YES

Supports PWM channels for precise control of analog signals, enabling applications such as motor speed control or LED dimming with high accuracy.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updating of firmware, enabling flexibility in changing or upgrading the microcontroller's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting of the microcontroller on the PCB, saving space and improving the overall efficiency of the system.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller has moderate sensitivity to moisture exposure, ensuring proper handling and storage to maintain performance.

Speed: 50 rpm

With a speed of 50 rpm, the microcontroller is capable of handling tasks with moderate processing requirements, making it suitable for a wide range of applications.

No. of I/O Lines: 33

33 I/O lines provide sufficient connectivity options for interfacing with external devices and sensors, making the microcontroller versatile for a variety of applications.

Technical Specifications

Microcontrollers LM3S5662-IQR50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5662-IQR50-A0T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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