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LM3S5656-IQR80-C0

Texas Instruments

LM3S5656-IQR80-C0 by Texas Instruments

LM3S5656-IQR80-C0 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels, as well as PWM functionality. The package style is flatpack with a terminal pitch of 0.5 mm, making it ideal for compact designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,485 parts In-Stock

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7,485

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Digiode

USA . 2,096 parts In-Stock

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2,096

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Distributors (Availability)

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One Stop Electronics

USA . 638 parts In-Stock

1+ parts

$8.000

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638

$8.000

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AZTECH Wire

Italy . 724 parts In-Stock

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$10.448

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724

$10.448

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Parana Technologies

USA . 271 parts In-Stock

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$24.934

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$25.631

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271

$24.934

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$25.631

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IDEA Electronic Components Group

UK . 1,988 parts In-Stock

1+ parts

$28.016

100+ parts

$26.615

1k+ parts

$25.214

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1,988

$28.016

$26.615

$25.214

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ChromeModa Solutions

Germany . 1,575 parts In-Stock

1+ parts

$28.016

100+ parts

$22.973

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1,575

$28.016

$22.973

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Corphita

USA . 3,414 parts In-Stock

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3,414

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Microchip USA

USA . 391 parts In-Stock

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391

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DigiPath Technology Company

USA . 376 parts In-Stock

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$25.259

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376

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$25.259

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the LM3S5656-IQR80-C0 microcontroller. This cutting-edge device offers endless possibilities in a compact package, making it perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller provides exceptional value and performance. Trust Texas Instruments to deliver innovative solutions that exceed your expectations. Elevate your projects with the LM3S5656-IQR80-C0 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product more affordable for consumers.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, saving time and reducing production costs.

Maximum Supply Voltage: 1.32 V

This allows for flexibility in powering the microcontroller while still providing a sufficient voltage for stable operation.

Package Shape: SQUARE

A square package shape is often more compact and efficient for space-saving designs, making it ideal for small electronic devices.

Bit Size: 32

A higher bit size allows for more complex operations and calculations, making the microcontroller suitable for a wider range of applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for compatibility with different electronic systems and power requirements.

No. of Terminals: 64

A higher number of terminals provides more connectivity options and flexibility for interfacing with other components in a circuit.

Package Style (Meter): FLATPACK

The flatpack style is space-efficient and allows for easier mounting and integration into electronic devices.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even at lower power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microcontroller suitable for industrial applications where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the microcontroller can function reliably in harsh environmental conditions.

ADC Channels: YES

Analog-to-digital converter channels allow the microcontroller to interface with analog sensors and devices, expanding its range of applications.

DMA Channels: YES

Direct Memory Access channels enable faster data transfer and processing, improving the overall performance of the microcontroller.

Terminal Position: QUAD

Quad terminal position provides more options for connectivity and routing of signals within a circuit, enhancing flexibility in design.

ROM Words: 131072

A higher ROM word capacity allows for more program storage, enabling complex algorithms and applications to be implemented on the microcontroller.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for space-constrained designs, allowing for slim and compact electronic devices.

Width: 10 mm

A compact width makes the microcontroller suitable for small-scale applications where space is limited.

Maximum Clock Frequency: 0.032 MHz

A high maximum clock frequency allows for fast data processing and real-time operation in dynamic systems.

Length: 10 mm

A short length complements the compact design of the microcontroller, making it suitable for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and robust performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates multiple functions on a single chip, reducing the need for external components and simplifying circuit design.

RAM Bytes: 32768

A generous RAM capacity allows for efficient data storage and manipulation, supporting multitasking and complex applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable signal transmission in the microcontroller.

Nominal Supply Voltage: 1.2 V

A stable nominal supply voltage ensures consistent performance and reliability of the microcontroller in various operating conditions.

PWM Channels: YES

Pulse width modulation channels enable precise control of analog signals, making the microcontroller suitable for applications requiring accurate voltage regulation.

ROM Programmability: FLASH

Flash programmability allows for easy and fast updates to the microcontroller's firmware, enabling flexibility and adaptability in the product's functionality.

Terminal Pitch: 0.5 mm

A small terminal pitch facilitates high-density mounting of the microcontroller, optimizing PCB space and enabling compact electronic designs.

Speed: 80 rpm

A high speed rating allows for rapid data processing and response times, enhancing the performance of the microcontroller in dynamic applications.

No. of I/O Lines: 33

A sufficient number of input/output lines provides versatility and flexibility for interfacing with external devices and peripherals, expanding the capabilities of the microcontroller.

Technical Specifications

Microcontrollers LM3S5656-IQR80-C0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5656-IQR80-C0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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