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LM3S3Z26-IQR50-C5T

Texas Instruments

LM3S3Z26-IQR50-C5T by Texas Instruments

LM3S3Z26-IQR50-C5T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 6144 bytes of RAM and flash ROM programmability, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a wide temperature range from -40 to 85°C, it offers reliable performance in various environments.

Median Price

$8.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$7.750

1k+ parts

$6.940

10k+ parts

$6.530

850

-

$7.750

$6.940

$6.530

DigiKey

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$8.950

1k+ parts

-

10k+ parts

-

850

-

$8.950

-

-

Verical

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$9.688

1k+ parts

$8.675

10k+ parts

$8.162

850

-

$9.688

$8.675

$8.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,854 parts In-Stock

1+ parts

$8.180

100+ parts

-

1k+ parts

-

10k+ parts

-

2,854

$8.180

-

-

-

Vyrian

USA . 7,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,791

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,980 parts In-Stock

1+ parts

$7.749

100+ parts

-

1k+ parts

-

10k+ parts

-

2,980

$7.749

-

-

-

Parana Technologies

USA . 1,279 parts In-Stock

1+ parts

$69.423

100+ parts

-

1k+ parts

-

10k+ parts

-

1,279

$69.423

-

-

-

ChromeModa Solutions

Germany . 2,321 parts In-Stock

1+ parts

$78.003

100+ parts

$63.962

1k+ parts

-

10k+ parts

-

2,321

$78.003

$63.962

-

-

IDEA Electronic Components Group

UK . 278 parts In-Stock

1+ parts

$78.003

100+ parts

$74.103

1k+ parts

$70.203

10k+ parts

-

278

$78.003

$74.103

$70.203

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

DigiPath Technology Company

USA . 889 parts In-Stock

1+ parts

-

100+ parts

$70.328

1k+ parts

-

10k+ parts

-

889

-

$70.328

-

-

Kepictronics

USA . 850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

850

-

-

-

-

Microchip USA

USA . 248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

248

-

-

-

-

Overview

Elevate your projects with the LM3S3Z26-IQR50-C5T by Texas Instruments, a top-of-the-line microcontroller that delivers unrivaled performance and reliability. Crafted by a renowned manufacturer, this device boasts cutting-edge technology and versatile applications in various industries. Experience seamless integration, high-speed processing, and efficient power management with this innovative solution. Upgrade your systems with the LM3S3Z26-IQR50-C5T and unlock a world of possibilities for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Cost-effective material for packaging while still providing durability and protection to the microcontroller.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Compact shape that helps in efficient use of space on PCBs.

Bit Size: 32

Higher bit size allows for processing larger amounts of data quickly and efficiently.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options, allowing flexibility in design and power management.

No. of Terminals: 64

Sufficient number of terminals for connecting to various components and peripherals in a system.

Package Style (Meter): FLATPACK

Flatpack design is space-saving and suitable for compact electronic devices.

Minimum Supply Voltage: 3 V

Supports low supply voltages, enabling operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M3

Efficient and powerful CPU architecture for handling a variety of tasks in embedded systems.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, suitable for harsh environments.

ADC Channels: YES

Built-in Analog-to-Digital Converter channels for interfacing with analog signals.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer between peripherals and memory.

Terminal Position: QUAD

Quad terminal position for stable and secure connection on PCBs.

ROM Words: 16384

Sufficient ROM memory for storing program code and data.

Maximum Seated Height: 1.6 mm

Low-profile design suitable for compact electronic devices.

Width: 10 mm

Compact width for efficient placement on circuit boards.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing speed and response time.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering during manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints.

Length: 10 mm

Compact length for efficient use of space on PCBs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller functionality for versatile embedded system design.

RAM Bytes: 6144

Sufficient RAM memory for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections.

Maximum Supply Current: 129 mA

Low supply current for efficient power consumption.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage for stable and reliable operation.

PWM Channels: YES

Pulse Width Modulation channels for controlling electronic devices with analog signals.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates to program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 for safe storage and handling.

Speed: 50 rpm

Operates at 50 revolutions per minute for precise control in motor applications.

No. of I/O Lines: 33

Sufficient number of input/output lines for interfacing with external components.

Technical Specifications

Microcontrollers LM3S3Z26-IQR50-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3Z26-IQR50-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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