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LM3S3Z26-IQR50-C5

Texas Instruments

LM3S3Z26-IQR50-C5 by Texas Instruments

LM3S3Z26-IQR50-C5 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 6144 bytes of RAM, Flash ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,233 parts In-Stock

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Digiode

USA . 3,721 parts In-Stock

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AZTECH Wire

Italy . 667 parts In-Stock

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$9.360

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One Stop Electronics

USA . 677 parts In-Stock

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$17.000

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Parana Technologies

USA . 7 parts In-Stock

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$41.380

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ChromeModa Solutions

Germany . 2,454 parts In-Stock

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$46.494

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$38.125

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IDEA Electronic Components Group

UK . 57 parts In-Stock

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$46.494

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$44.169

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$41.845

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57

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$41.845

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QUARKTWIN TECHNOLOGY LTD

USA . 22,989 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 2,340 parts In-Stock

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$41.919

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Microchip USA

USA . 147 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S3Z26-IQR50-C5 microcontroller by Texas Instruments. Designed with precision and efficiency in mind, this powerful device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this Cortex-M3 CPU family microcontroller delivers seamless operation and exceptional value. Experience innovation at its finest with the LM3S3Z26-IQR50-C5 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable operation in various environments.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications while ensuring safe operation within specified voltage limits.

Bit Size: 32

Offers high processing capabilities, allowing for complex tasks to be performed efficiently.

Power Supplies (V): 1.3,3.3

Provides flexibility in power options, catering to different power requirements in various applications.

No. of Terminals: 64

Offers ample connectivity options for interfacing with external devices, expanding the functionality of the microcontroller.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in harsh environmental conditions with low temperatures.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient CPU architecture, enabling high-performance computing tasks to be executed smoothly.

ADC Channels: YES

Facilitates analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Enables direct memory access for efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 16384

Offers generous ROM capacity for storing program code and data, accommodating larger software applications.

RAM Bytes: 6144

Provides sufficient volatile memory for data storage and manipulation during program execution, enhancing processing capabilities.

Technology: CMOS

Utilizes low-power CMOS technology, reducing power consumption and heat generation for energy-efficient operation.

PWM Channels: YES

Supports Pulse-Width Modulation (PWM) output for precise control of analog signals, suitable for motor control and other applications.

Technical Specifications

Microcontrollers LM3S3Z26-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3Z26-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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