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LM3S3Z26-IQR50-C3T

Texas Instruments

LM3S3Z26-IQR50-C3T by Texas Instruments

LM3S3Z26-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a supply voltage range of 3V to 3.6V. The package style is flatpack with gull wing terminals, making it ideal for compact designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,408 parts In-Stock

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Digiode

USA . 560 parts In-Stock

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560

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Distributors (Availability)

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AZTECH Wire

Italy . 597 parts In-Stock

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$13.056

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One Stop Electronics

USA . 1,072 parts In-Stock

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$14.000

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Parana Technologies

USA . 2,298 parts In-Stock

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$32.183

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$100.069

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DigiPath Technology Company

USA . 223 parts In-Stock

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$35.438

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223

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ChromeModa Solutions

Germany . 184 parts In-Stock

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$36.161

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$29.652

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$36.161

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IDEA Electronic Components Group

UK . 87 parts In-Stock

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$36.161

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$34.353

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$32.545

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87

$36.161

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$32.545

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Microchip USA

USA . 6,000 parts In-Stock

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Corphita

USA . 1,007 parts In-Stock

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Overview

Unlock the potential of your next project with the LM3S3Z26-IQR50-C3T microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled quality and reliability. Ideal for a range of applications, this microcontroller provides seamless performance and efficiency. With its advanced features and cutting-edge technology, the LM3S3Z26-IQR50-C3T guarantees value and benefits for customers seeking top-notch solutions. Experience innovation at its finest with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Provides a suitable power supply for the microcontroller.

Package Shape: SQUARE

Square shape allows for compact placement on the board.

Bit Size: 32

32-bit architecture enables processing of larger amounts of data efficiently.

No. of Terminals: 64

Having 64 terminals allows for various connections and functionalities.

Package Style (Meter): FLATPACK

Flatpack style offers a low-profile design for space-saving on the board.

Minimum Supply Voltage: 3 V

Provides a reliable minimum power supply for the microcontroller to function properly.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate effectively even in extreme low temperatures.

ADC Channels: YES

Analog-to-digital converter channels allow for the conversion of analog signals for digital processing.

DMA Channels: YES

Direct Memory Access channels improve data transfer speeds and efficiency.

Terminal Position: QUAD

Quad terminal position provides stability and multiple connection options.

Maximum Seated Height: 1.6 mm

Low seated height allows for compact design and space-saving on the board.

Width: 10 mm

Narrow width enables placement in tight spaces on the circuit board.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing and response times.

Length: 10 mm

Short length helps in fitting the microcontroller in constrained spaces.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range ensures reliability and durability in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller for efficient control and processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed capabilities.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and easy soldering.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for reliable performance of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog components.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of the microcontroller's firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables dense packaging and space optimization on the board.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate sensitivity to moisture, suitable for various environmental conditions.

Speed: 50 rpm

Capable of processing data at a speed of 50 revolutions per minute.

No. of I/O Lines: 33

Having 33 I/O lines allows for versatile input and output connections for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S3Z26-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3Z26-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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