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LM3S3Z26-IQR50-C0

Texas Instruments

LM3S3Z26-IQR50-C0 by Texas Instruments

LM3S3Z26-IQR50-C0 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 50 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and control capabilities. With a wide temperature range from -40°C to 85°C, it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,455 parts In-Stock

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3,455

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Digiode

USA . 3,439 parts In-Stock

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3,439

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Distributors (Availability)

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AZTECH Wire

Italy . 356 parts In-Stock

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$16.052

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356

$16.052

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Parana Technologies

USA . 900 parts In-Stock

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$17.319

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$17.532

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900

$17.319

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$17.532

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DigiPath Technology Company

USA . 1,237 parts In-Stock

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$19.071

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$19.071

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IDEA Electronic Components Group

UK . 543 parts In-Stock

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$19.460

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$18.487

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$17.514

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543

$19.460

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$17.514

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ChromeModa Solutions

Germany . 450 parts In-Stock

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$19.460

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$15.957

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450

$19.460

$15.957

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One Stop Electronics

USA . 1,098 parts In-Stock

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$35.000

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Corphita

USA . 963 parts In-Stock

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Microchip USA

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Overview

Experience the superior quality and cutting-edge technology of Texas Instruments with the LM3S3Z26-IQR50-C0 microcontroller. This versatile device offers a wide range of applications in various industries, providing customers with unmatched performance and reliability. With features such as ADC channels, PWM channels, and DMA channels, this product delivers exceptional value and benefits to meet all your needs. Trust in Texas Instruments to deliver top-of-the-line solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation and compact design.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power supply options.

Package Shape: SQUARE

Square shape allows for efficient use of space on the board.

Bit Size: 32

Offers high processing capability for complex operations.

No. of Terminals: 64

Sufficient number of terminals for connectivity and expansion.

Package Style (Meter): FLATPACK

Flatpack design simplifies PCB layout and assembly process.

Minimum Supply Voltage: 1.08 V

Provides low power operation and energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold environments.

ADC Channels: YES

Integrated ADC channels for analog signal processing.

DMA Channels: YES

DMA channels enhance data transfer efficiency and speed.

Terminal Position: QUAD

Quad terminal position for easy connectivity and wiring.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim devices.

Width: 10 mm

Compact width for space-constrained applications.

Maximum Clock Frequency: 50 MHz

High clock frequency for fast processing and response times.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller for streamlined system design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Integrated PWM channels for precise control of output signals.

ROM Programmability: FLASH

Flash ROM for easy and flexible firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and compact layout.

Speed: 50 rpm

Operates at a speed of 50 rpm for efficient data processing.

No. of I/O Lines: 33

Sufficient number of I/O lines for versatile connectivity and interfacing.

Technical Specifications

Microcontrollers LM3S3Z26-IQR50-C0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3Z26-IQR50-C0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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