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LM3S3W26-IQR50-C3T

Texas Instruments

LM3S3W26-IQR50-C3T by Texas Instruments

LM3S3W26-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 8192 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,882 parts In-Stock

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Digiode

USA . 2,293 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 717 parts In-Stock

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$8.444

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717

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One Stop Electronics

USA . 1,151 parts In-Stock

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$19.000

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Parana Technologies

USA . 2,302 parts In-Stock

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$67.612

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DigiPath Technology Company

USA . 144 parts In-Stock

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$74.449

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144

$74.449

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ChromeModa Solutions

Germany . 1,138 parts In-Stock

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$75.968

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$62.294

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$75.968

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IDEA Electronic Components Group

UK . 129 parts In-Stock

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$75.968

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$72.170

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$68.371

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129

$75.968

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$68.371

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Corphita

USA . 3,043 parts In-Stock

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Microchip USA

USA . 336 parts In-Stock

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Overview

Elevate your projects to the next level with the LM3S3W26-IQR50-C3T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that set the standard for performance and reliability. Ideal for a wide range of applications, this microcontroller offers unmatched value with its advanced features and capabilities. Experience the benefits of seamless integration, efficient power management, and superior processing speed. Invest in the LM3S3W26-IQR50-C3T and unlock endless possibilities for innovation and success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with various power sources and voltage requirements.

Bit Size: 32

Provides sufficient processing power for various applications, making the microcontroller versatile and capable of handling complex tasks.

Power Supplies (V): 1.2,3.3

Offers flexibility in power options, allowing the microcontroller to operate efficiently in different power environments.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and peripherals, enhancing the microcontroller's functionality.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making the microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Allows the microcontroller to operate in a wide range of temperatures, ensuring reliability in both extreme cold and hot conditions.

ADC Channels: YES

Enables analog-to-digital conversion, making the microcontroller suitable for applications that require monitoring and processing analog signals.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, enhancing the microcontroller's performance in data-intensive applications.

ROM Words: 32768

Provides ample storage for program code, data, and configuration settings, making the microcontroller versatile and suitable for diverse applications.

RAM Bytes: 8192

Offers sufficient memory for storing and manipulating data during runtime, enabling the microcontroller to handle complex algorithms and tasks efficiently.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance and compatibility with peripheral devices.

PWM Channels: YES

Enables pulse-width modulation output, allowing precise control of motors, actuators, and other devices, making the microcontroller suitable for robotics and automation applications.

ROM Programmability: FLASH

Allows for easy and convenient programming of the microcontroller's memory, enabling quick prototyping and development of applications.

Technical Specifications

Microcontrollers LM3S3W26-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3W26-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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