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LM3S3N26-IQR50-C5T

Texas Instruments

LM3S3N26-IQR50-C5T by Texas Instruments

LM3S3N26-IQR50-C5T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16.384 MHz. It features 33 I/O lines, ADC and DMA channels, and 12288 bytes of RAM. Ideal for industrial applications requiring high-speed processing and precise control in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,429 parts In-Stock

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5,429

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Digiode

USA . 4,643 parts In-Stock

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4,643

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Distributors (Availability)

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One Stop Electronics

USA . 430 parts In-Stock

1+ parts

$3.000

100+ parts

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430

$3.000

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AZTECH Wire

Italy . 198 parts In-Stock

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$7.725

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198

$7.725

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Parana Technologies

USA . 1,676 parts In-Stock

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$44.772

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1,676

$44.772

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DigiPath Technology Company

USA . 1,760 parts In-Stock

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$49.300

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1,760

$49.300

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ChromeModa Solutions

Germany . 3,072 parts In-Stock

1+ parts

$50.306

100+ parts

$41.251

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3,072

$50.306

$41.251

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IDEA Electronic Components Group

UK . 2,280 parts In-Stock

1+ parts

$50.306

100+ parts

$47.791

1k+ parts

$45.275

10k+ parts

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2,280

$50.306

$47.791

$45.275

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Corphita

USA . 429 parts In-Stock

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429

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Microchip USA

USA . 258 parts In-Stock

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Overview

Experience the next level of innovation with the LM3S3N26-IQR50-C5T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller offers unparalleled performance and versatility, making it ideal for a wide range of applications. With advanced features such as ADC and DMA channels, as well as PWM capabilities, this product provides exceptional value and efficiency to customers. Explore new possibilities and unlock endless opportunities with the LM3S3N26-IQR50-C5T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the microcontroller.

Surface Mount: YES

Surface mount feature allows for easy installation and saves space on the circuit board.

Maximum Supply Voltage: 1.365 V

Operates efficiently with a maximum supply voltage of 1.365 V.

Package Shape: SQUARE

Square package shape makes it easier to handle and mount on the circuit board.

Bit Size: 32

32-bit size allows for handling complex calculations and operations efficiently.

Power Supplies (V): 1.2, 3.3

Supports multiple power supply voltages for flexibility in different applications.

No. of Terminals: 64

Has a sufficient number of terminals for connecting various external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Variety of package styles offer compatibility with different types of circuit boards and designs.

Minimum Supply Voltage: 1.235 V

Operates efficiently even at low supply voltages, increasing versatility in power sources.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

CPU Family: CORTEX-M3

Belongs to the efficient and powerful Cortex-M3 CPU family, ensuring high performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte Tin finish provides good solderability and ensures a reliable connection.

ADC Channels: YES

Analog-to-Digital Converter channels allow for accurate conversion of analog signals to digital data.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfers without CPU intervention.

Terminal Position: QUAD

Quad terminal position makes it easier to solder and provides a stable connection.

ROM Words: 65536

Large ROM size allows for storage of program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height saves space on the circuit board and allows for compact designs.

Width: 10 mm

Compact width makes it suitable for applications with limited space.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency enables fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during soldering processes.

Length: 10 mm

Compact length makes it suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller type offers integrated peripherals for versatile functionality.

RAM Bytes: 12288

Large RAM capacity allows for temporary data storage during operation.

Technology: CMOS

CMOS technology provides power efficiency and faster operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and easy soldering.

Nominal Supply Voltage: 1.3 V

Operates efficiently with a nominal supply voltage of 1.3 V.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of outputs.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing environments.

Speed: 50 rpm

High processing speed of 50 rpm allows for quick data manipulation and response times.

No. of I/O Lines: 33

Sufficient number of I/O lines for connecting external devices and peripherals.

Technical Specifications

Microcontrollers LM3S3N26-IQR50-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3N26-IQR50-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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