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LM3S3N26-IQR50-C5

Texas Instruments

LM3S3N26-IQR50-C5 by Texas Instruments

LM3S3N26-IQR50-C5 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16.384 MHz clock frequency. It features 33 I/O lines, 12288 bytes of RAM, and FLASH ROM programmability. Ideal for industrial applications requiring high-speed processing and multiple PWM channels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,508 parts In-Stock

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Digiode

USA . 1,459 parts In-Stock

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1,459

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AZTECH Wire

Italy . 421 parts In-Stock

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$13.611

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One Stop Electronics

USA . 607 parts In-Stock

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$18.000

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Parana Technologies

USA . 1,974 parts In-Stock

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$56.013

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ChromeModa Solutions

Germany . 4,395 parts In-Stock

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$62.936

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$51.608

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IDEA Electronic Components Group

UK . 1,085 parts In-Stock

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$62.936

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$59.789

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$56.642

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Lixinc

USA . 18,549 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Corphita

USA . 2,936 parts In-Stock

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DigiPath Technology Company

USA . 2,081 parts In-Stock

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$56.743

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A-Z Elektronik GmbH

Germany . 326 parts In-Stock

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Microchip USA

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Overview

Experience the cutting-edge technology and reliability of Texas Instruments with the LM3S3N26-IQR50-C5 microcontroller. This powerful device offers seamless integration into a wide range of applications, providing customers with unmatched performance and efficiency. With its 32-bit architecture and advanced features like ADC and DMA channels, this microcontroller is perfect for industrial-grade projects where accuracy and speed are essential. Trust in Texas Instruments to deliver top-notch quality and innovative solutions for all your microcontroller needs. Elevate your designs with the LM3S3N26-IQR50-C5 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and enabling efficient manufacturing processes.

Maximum Supply Voltage: 1.365 V

Operating within a maximum supply voltage of 1.365V ensures power efficiency and prevents damage to the microcontroller.

Package Shape: SQUARE

Square package shape is compact and convenient for placement on a PCB, optimizing space utilization.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex operations and calculations efficiently.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows flexibility in design and compatibility with different power sources.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with other components or peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer versatility in mounting and deployment, catering to different PCB layout requirements.

Minimum Supply Voltage: 1.235 V

Operating at a minimum supply voltage of 1.235V allows for efficient power consumption and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliability in demanding industrial environments.

CPU Family: CORTEX-M3

Utilizing the Cortex-M3 CPU family provides high performance and efficiency for executing tasks and handling real-time operations.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can function reliably in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, ensuring secure electrical connections.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion for interfacing with sensors, enabling data acquisition and processing.

DMA Channels: YES

Support for DMA channels enhances data transfer efficiency and offloads the CPU for better performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and routing, simplifying the assembly process.

ROM Words: 65536

With a ROM capacity of 65536 words, the microcontroller can store program code efficiently for executing tasks and functions.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm enables a compact overall design and facilitates installation in space-constrained applications.

Width: 10 mm

Compact width of 10mm allows for efficient placement on the PCB, optimizing space utilization in device design.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency of 16.384 MHz supports fast processing speeds and real-time operation for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can withstand soldering processes without damage.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper solder joint formation during assembly, enhancing reliability.

Length: 10 mm

Compact length of 10mm allows for efficient placement on the PCB, optimizing space utilization in device design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripheral interfaces, this product can control and communicate with external devices effectively.

RAM Bytes: 12288

With 12288 bytes of RAM, the microcontroller can efficiently store and access data during program execution, enhancing performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making it an efficient choice for the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and facilitates automated assembly processes, ensuring reliable connectivity.

Nominal Supply Voltage: 1.3 V

Operating at a nominal supply voltage of 1.3V offers a balance between power efficiency and performance for the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and modification of program code, facilitating flexible development and application customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB layout and miniaturization of electronic devices, saving space and improving design aesthetics.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the microcontroller can withstand appropriate levels of moisture exposure during storage and assembly processes.

Speed: 50 rpm

Operating at a speed of 50 revolutions per minute allows for efficient execution of tasks and operations, contributing to overall system performance.

No. of I/O Lines: 33

Having 33 I/O lines provides sufficient input/output interfaces for connecting to external devices, sensors, and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LM3S3N26-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3N26-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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