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LM3S3N26-IQR50-C3T

Texas Instruments

LM3S3N26-IQR50-C3T by Texas Instruments

LM3S3N26-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 33 I/O lines, ADC and DMA channels, and 12288 bytes of RAM. Ideal for industrial applications requiring high-speed processing and precise control with a supply voltage range of 1.2V to 3.3V.

Median Price

$31.483

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$31.483

100+ parts

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64

$31.483

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Digiode

USA . 3,863 parts In-Stock

1+ parts

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3,863

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Vyrian

USA . 3,435 parts In-Stock

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3,435

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$7.084

100+ parts

-

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244

$7.084

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One Stop Electronics

USA . 565 parts In-Stock

1+ parts

$14.000

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565

$14.000

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Parana Technologies

USA . 2,264 parts In-Stock

1+ parts

$57.501

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2,264

$57.501

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DigiPath Technology Company

USA . 1,813 parts In-Stock

1+ parts

$63.316

100+ parts

$58.251

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1,813

$63.316

$58.251

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ChromeModa Solutions

Germany . 4,697 parts In-Stock

1+ parts

$64.608

100+ parts

$52.979

1k+ parts

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4,697

$64.608

$52.979

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$64.608

100+ parts

$61.378

1k+ parts

$58.147

10k+ parts

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1,185

$64.608

$61.378

$58.147

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Corphita

USA . 1,475 parts In-Stock

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1,475

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Microchip USA

USA . 345 parts In-Stock

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345

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Overview

Unlock endless possibilities with the Texas Instruments LM3S3N26-IQR50-C3T microcontroller. Designed with top-notch quality and cutting-edge technology, this versatile device offers unmatched performance and reliability in a compact package. Perfect for a wide range of applications, from industrial automation to consumer electronics, this microcontroller boasts fast processing speeds, ample memory, and a variety of built-in features to streamline your projects. Trust Texas Instruments to deliver superior products that exceed expectations and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making the product suitable for compact electronic designs.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage ensures compatibility with a wide range of power sources, enhancing versatility.

Package Shape: SQUARE

Square package shape enables efficient use of space on the circuit board, facilitating compact designs.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance for applications requiring complex computations.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexible operation and compatibility with different power sources.

No. of Terminals: 64

Ample number of terminals offer extensive connectivity options, enabling integration with various external components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 65536

Large ROM capacity allows for storing program instructions and data, enabling the microcontroller to support complex software applications.

Maximum Seated Height: 1.6 mm

Low seated height makes the microcontroller suitable for slim and compact electronic designs.

Width: 10 mm

Compact width dimension allows for space-efficient placement on the circuit board, enhancing design flexibility.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency supports fast processing speed, making the microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering during manufacturing processes, improving product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for robust soldering connections, enhancing durability and lifecycle of the product.

Length: 10 mm

Compact length dimension enables efficient use of space on the circuit board, contributing to overall design optimization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in rugged industrial environments, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Inclusion of microcontroller peripheral IC type provides a comprehensive set of features for embedded system development, enhancing versatility.

RAM Bytes: 12288

Generous RAM capacity enables efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections, ensuring reliable electrical contact.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

PWM channels enable precise control of analog signals, making the microcontroller suitable for motor control and LED dimming applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates, enhancing flexibility and adaptability of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging, making the microcontroller suitable for miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring appropriate handling during storage and assembly processes.

Speed: 50 rpm

High speed capability supports rapid data processing and communication, enhancing overall system performance.

No. of I/O Lines: 33

Ample number of I/O lines provide flexibility for interfacing with external devices and sensors, making the microcontroller versatile for different applications.

Technical Specifications

Microcontrollers LM3S3N26-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3N26-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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