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LM3S3J26-IQR50-C5

Texas Instruments

LM3S3J26-IQR50-C5 by Texas Instruments

Texas Instruments LM3S3J26-IQR50-C5 is a 32-bit Cortex-M3 microcontroller with 131072 ROM words, 20480 RAM bytes, and 33 I/O lines. It operates at up to 50 MHz clock frequency and has ADC and DMA channels for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,232 parts In-Stock

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7,232

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Digiode

USA . 772 parts In-Stock

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772

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Distributors (Availability)

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AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$13.011

100+ parts

-

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669

$13.011

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One Stop Electronics

USA . 131 parts In-Stock

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$22.000

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131

$22.000

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Parana Technologies

USA . 2,296 parts In-Stock

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$49.644

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2,296

$49.644

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DigiPath Technology Company

USA . 1,434 parts In-Stock

1+ parts

$54.664

100+ parts

$50.291

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1,434

$54.664

$50.291

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ChromeModa Solutions

Germany . 6,187 parts In-Stock

1+ parts

$55.780

100+ parts

$45.740

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6,187

$55.780

$45.740

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IDEA Electronic Components Group

UK . 382 parts In-Stock

1+ parts

$55.780

100+ parts

$52.991

1k+ parts

$50.202

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382

$55.780

$52.991

$50.202

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Corphita

USA . 4,897 parts In-Stock

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4,897

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Microchip USA

USA . 160 parts In-Stock

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160

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Overview

Unlock endless possibilities with the LM3S3J26-IQR50-C5 microcontroller from Texas Instruments. Expertly crafted with top-notch quality, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller is designed to meet all your needs. Experience seamless functionality and superior efficiency with this cutting-edge product. Upgrade your projects today with the LM3S3J26-IQR50-C5 and discover the true potential of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Ease of installation and space-saving design for compact applications.

Maximum Supply Voltage: 1.32 V

Efficient power management and compatibility with low voltage systems.

Package Shape: SQUARE

Simplifies PCB layout and allows for efficient use of space.

Bit Size: 32

High processing capability for complex applications.

Power Supplies (V): 1.2,3.3

Versatility in power options for different voltage requirements.

No. of Terminals: 64

Sufficient connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK

Provides a compact form factor suitable for space-constrained designs.

Minimum Supply Voltage: 1.08 V

Support for low voltage operation, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature requirements.

CPU Family: CORTEX-M3

A powerful and efficient processor architecture for demanding applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for use in extreme conditions.

Terminal Finish: MATTE TIN

Enhanced solderability and corrosion resistance for long-lasting connectivity.

ADC Channels: YES

Integrated Analog-to-Digital converters for sensor interfacing and data acquisition.

DMA Channels: YES

Support for Direct Memory Access for efficient data transfer and processing.

Terminal Position: QUAD

Optimal terminal arrangement for easy PCB assembly and layout.

ROM Words: 131072

Ample memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for compact and slim devices.

Width: 10 mm

Compact form factor suitable for small footprint designs.

Maximum Clock Frequency: 50 MHz

High clock speed for fast and responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow soldering process for manufacturing.

Peak Reflow Temperature °C: 260

High-temperature tolerance for robust soldering processes.

Length: 10 mm

Compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for embedded control applications.

RAM Bytes: 20480

Sufficient memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Robust terminal design for secure solder joints.

Nominal Supply Voltage: 1.2 V

Standard voltage supply for stable operation.

PWM Channels: YES

Support for Pulse Width Modulation for precise control of outputs.

ROM Programmability: FLASH

Flexible and reprogrammable memory for firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity.

Speed: 50 rpm

Operates at a high speed for responsive performance.

No. of I/O Lines: 33

Plenty of input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S3J26-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3J26-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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