Loading...

LM3S3J26-IQR50-C3T

Texas Instruments

LM3S3J26-IQR50-C3T by Texas Instruments

LM3S3J26-IQR50-C3T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 20480 RAM bytes, and 33 I/O lines. It operates at a max clock frequency of 16 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,803

-

-

-

-

Digiode

USA . 1,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,074

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 535 parts In-Stock

1+ parts

$8.258

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$8.258

-

-

-

One Stop Electronics

USA . 1,103 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,103

$28.000

-

-

-

Parana Technologies

USA . 490 parts In-Stock

1+ parts

$50.961

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$50.961

-

-

-

DigiPath Technology Company

USA . 1,158 parts In-Stock

1+ parts

$56.114

100+ parts

$51.625

1k+ parts

-

10k+ parts

-

1,158

$56.114

$51.625

-

-

ChromeModa Solutions

Germany . 1,418 parts In-Stock

1+ parts

$57.259

100+ parts

$46.952

1k+ parts

-

10k+ parts

-

1,418

$57.259

$46.952

-

-

IDEA Electronic Components Group

UK . 158 parts In-Stock

1+ parts

$57.259

100+ parts

$54.396

1k+ parts

$51.533

10k+ parts

-

158

$57.259

$54.396

$51.533

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,774

-

-

-

-

Microchip USA

USA . 5,781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,781

-

-

-

-

Corphita

USA . 4,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,438

-

-

-

-

Overview

Unleash the power of innovation with the LM3S3J26-IQR50-C3T by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From smart devices to industrial automation, this versatile component is designed to exceed expectations. Embrace the future of technology with seamless integration, superior efficiency, and enhanced functionality. Elevate your projects and unlock endless possibilities with the LM3S3J26-IQR50-C3T. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto PCBs, saving time and effort in production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square package shape can help in optimizing space on the PCB and allows for efficient placement in compact designs.

Bit Size: 32

A 32-bit microcontroller offers higher processing power and efficiency compared to lower bit sizes, making it suitable for complex tasks.

Power Supplies (V): 1.2, 3.3

Having multiple power supply options allows for flexibility in design and integration with different systems that may require different voltage levels.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and external components, enabling versatile functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates a CPU, memory, and I/O peripherals in a single chip, simplifying system design and reducing overall cost.

RAM Bytes: 20480

With a large RAM size of 20480 bytes, the microcontroller can handle complex data processing tasks efficiently and with sufficient memory capacity.

Technical Specifications

Microcontrollers LM3S3J26-IQR50-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3J26-IQR50-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20