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LM3S3826-IQR50-C1

Texas Instruments

LM3S3826-IQR50-C1 by Texas Instruments

LM3S3826-IQR50-C1 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 0.032 MHz. It features 32768 bytes of RAM, 262144 ROM words, and supports ADC and DMA channels. Ideal for industrial applications requiring a high clock frequency and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,109 parts In-Stock

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Digiode

USA . 1,272 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 593 parts In-Stock

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$14.393

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593

$14.393

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One Stop Electronics

USA . 276 parts In-Stock

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$27.000

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276

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Parana Technologies

USA . 1,784 parts In-Stock

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$71.265

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DigiPath Technology Company

USA . 2,163 parts In-Stock

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$78.472

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2,163

$78.472

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ChromeModa Solutions

Germany . 1,671 parts In-Stock

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$80.073

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$65.660

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1,671

$80.073

$65.660

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IDEA Electronic Components Group

UK . 998 parts In-Stock

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$80.073

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$76.069

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$72.066

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998

$80.073

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$72.066

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Corphita

USA . 879 parts In-Stock

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Microchip USA

USA . 171 parts In-Stock

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Kepictronics

USA . 40 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S3826-IQR50-C1 microcontroller. This versatile device offers high-quality performance and reliability in a compact package, making it perfect for a wide range of applications. With features like ADC and DMA channels, PWM capabilities, and a 32-bit architecture, this microcontroller provides exceptional value and benefits to customers looking for advanced control solutions. Trust Texas Instruments for superior quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides excellent durability and reliability for the microcontroller, ensuring a long lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the microcontroller onto a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32V allows for flexibility in power supply options, accommodating different system requirements.

Package Shape: SQUARE

The square package shape helps in easy placement and alignment of the microcontroller on the PCB, ensuring proper positioning during assembly.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high performance and processing capabilities, suitable for a wide range of applications.

RAM Bytes: 32768

The large RAM size of 32768 bytes enables efficient data storage and processing, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz allows for fast and efficient operation of the microcontroller, supporting rapid data processing.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed specifically for embedded systems and is equipped with various built-in peripherals for diverse applications.

Technical Specifications

Microcontrollers LM3S3826-IQR50-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3826-IQR50-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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