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LM3S3634-IQR50-A0T

Texas Instruments

LM3S3634-IQR50-A0T by Texas Instruments

LM3S3634-IQR50-A0T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 0.032 MHz. It features 131072 ROM words, 32768 RAM bytes, and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,559 parts In-Stock

1+ parts

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6,559

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Digiode

USA . 657 parts In-Stock

1+ parts

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100+ parts

-

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657

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$8.280

100+ parts

-

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417

$8.280

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Ampacity Inc.

Singapore . 889 parts In-Stock

1+ parts

$9.000

100+ parts

-

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889

$9.000

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One Stop Electronics

USA . 488 parts In-Stock

1+ parts

$12.000

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488

$12.000

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Parana Technologies

USA . 490 parts In-Stock

1+ parts

$19.533

100+ parts

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$19.536

10k+ parts

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490

$19.533

-

$19.536

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ChromeModa Solutions

Germany . 3,385 parts In-Stock

1+ parts

$21.947

100+ parts

$17.997

1k+ parts

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3,385

$21.947

$17.997

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IDEA Electronic Components Group

UK . 1,445 parts In-Stock

1+ parts

$21.947

100+ parts

$20.850

1k+ parts

$19.752

10k+ parts

-

1,445

$21.947

$20.850

$19.752

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Microchip USA

USA . 3,157 parts In-Stock

1+ parts

$28.950

100+ parts

$28.540

1k+ parts

$28.330

10k+ parts

$28.120

3,157

$28.950

$28.540

$28.330

$28.120

DigiPath Technology Company

USA . 2,066 parts In-Stock

1+ parts

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100+ parts

$19.787

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2,066

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$19.787

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Corphita

USA . 1,255 parts In-Stock

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1,255

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Overview

Unlock limitless possibilities with the LM3S3634-IQR50-A0T microcontroller by Texas Instruments. Crafted with precision and cutting-edge technology, this device offers unparalleled performance and reliability in a variety of applications. From industrial automation to consumer electronics, this microcontroller delivers seamless functionality and efficiency. Experience the power of innovation with Texas Instruments and revolutionize your projects with the LM3S3634-IQR50-A0T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 2.75 V

A relatively low maximum supply voltage ensures safe operation and protects the microcontroller from potential damage.

Package Shape: SQUARE

The square package shape is compact and space-efficient, ideal for applications where size is a concern.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance for demanding applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages offers flexibility and compatibility with different systems and components.

No. of Terminals: 64

A higher number of terminals allows for greater connectivity options and functionality in the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style is compact and suitable for applications where space-saving is important.

Minimum Supply Voltage: 2.25 V

A minimum supply voltage of 2.25 V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for operation in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable operation even in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a reliable connection for terminals.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing, making the microcontroller suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal positioning offers enhanced connectivity options, making it versatile for various PCB layouts.

ROM Words: 131072

A large ROM capacity allows for storing a significant amount of program data, enabling complex applications to be run on the microcontroller.

Maximum Seated Height: 1.6 mm

A low seated height makes the microcontroller suitable for slim and compact designs.

Width: 10 mm

The 10mm width provides a balance between compactness and ease of handling during PCB assembly.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency enables fast processing speeds, ideal for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The time at peak reflow temperature of 30 seconds allows for efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and connection reliability during PCB assembly.

Length: 10 mm

The 10mm length complements the compact square package shape, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions typically found in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller allows for efficient processing and execution of instructions, making it suitable for high-performance applications.

RAM Bytes: 32768

A generous RAM capacity enables efficient data processing and storage, enhancing the microcontroller's overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull-wing terminal form provides reliable solder joints and facilitates easy PCB assembly and rework.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V ensures stable operation within the specified voltage range, optimizing performance.

PWM Channels: YES

Support for PWM channels allows for precise control of output signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and convenient updating of firmware, enhancing the flexibility and longevity of the microcontroller.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm offers fine pitch connections, making the microcontroller suitable for high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller is sensitive to moisture exposure, requiring proper handling and storage to maintain performance.

Speed: 50 rpm

A motor speed of 50 rpm indicates the microcontroller's capability to control and regulate motor speed, ideal for motor control applications.

No. of I/O Lines: 33

33 I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers LM3S3634-IQR50-A0T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3634-IQR50-A0T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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