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LM3S3634-IQR50-A0

Texas Instruments

LM3S3634-IQR50-A0 by Texas Instruments

Texas Instruments LM3S3634-IQR50-A0 microcontroller features 32-bit CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications with -40 to 85°C operating range, it offers connectivity via I2C, SSI(2), UART(2), USB for versatile peripheral interfacing. With low power mode and integrated cache, it's suitable for power-efficient embedded systems.

Median Price

$19.462

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 852 parts In-Stock

1+ parts

-

100+ parts

$17.300

1k+ parts

$15.480

10k+ parts

$14.570

852

-

$17.300

$15.480

$14.570

DigiKey

USA . 852 parts In-Stock

1+ parts

-

100+ parts

$22.760

1k+ parts

-

10k+ parts

-

852

-

$22.760

-

-

Verical

USA . 852 parts In-Stock

1+ parts

-

100+ parts

$21.625

1k+ parts

$19.350

10k+ parts

$18.212

852

-

$21.625

$19.350

$18.212

Chip1Stop

Japan . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$14.600

10k+ parts

-

160

-

-

$14.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,003 parts In-Stock

1+ parts

$15.884

100+ parts

-

1k+ parts

-

10k+ parts

-

3,003

$15.884

-

-

-

Vyrian

USA . 8,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,268 parts In-Stock

1+ parts

$15.048

100+ parts

-

1k+ parts

-

10k+ parts

-

4,268

$15.048

-

-

-

Component Stockers USA

USA . 520 parts In-Stock

1+ parts

$17.070

100+ parts

$16.040

1k+ parts

-

10k+ parts

-

520

$17.070

$16.040

-

-

Parana Technologies

USA . 1,870 parts In-Stock

1+ parts

$19.691

100+ parts

-

1k+ parts

$19.683

10k+ parts

-

1,870

$19.691

-

$19.683

-

DigiPath Technology Company

USA . 984 parts In-Stock

1+ parts

$21.682

100+ parts

-

1k+ parts

-

10k+ parts

-

984

$21.682

-

-

-

ChromeModa Solutions

Germany . 2,726 parts In-Stock

1+ parts

$22.125

100+ parts

$18.142

1k+ parts

-

10k+ parts

-

2,726

$22.125

$18.142

-

-

IDEA Electronic Components Group

UK . 1,906 parts In-Stock

1+ parts

$22.125

100+ parts

$21.019

1k+ parts

$19.912

10k+ parts

-

1,906

$22.125

$21.019

$19.912

-

Microchip USA

USA . 343 parts In-Stock

1+ parts

$53.990

100+ parts

$53.600

1k+ parts

$53.600

10k+ parts

$53.220

343

$53.990

$53.600

$53.600

$53.220

Authorized Procurement Solutions

USA . 320,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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320,000

-

-

-

-

Kepictronics

USA . 4,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,480

-

-

-

-

GreenTree Electronics

Israel . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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800

-

-

-

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Perfect Parts

USA . 246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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246

-

-

-

-

Overview

Discover the LM3S3634-IQR50-A0 by Texas Instruments, a top-tier microcontroller offering unparalleled quality and reliability. Designed for industrial applications, this powerhouse from the renowned manufacturer boasts integrated cache, low power mode, and a wide range of connectivity options including I2C, UART, and USB. With flash ROM programmability and 8-channel ADC, this versatile device delivers exceptional performance and efficiency. Unlock endless possibilities with the LM3S3634-IQR50-A0, where cutting-edge technology meets seamless functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliability in various applications.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications and helps in efficiency of power management.

On Chip Data RAM Width: 8

Provides sufficient memory for data storage and manipulation within the microcontroller.

Bit Size: 32

Offers a good balance between performance and efficiency for various computing tasks.

Power Supplies (V): 2.5,3.3

Compatible with common voltage standards, making it versatile in integration with existing systems.

Package Style (Meter): FLATPACK

Facilitates easy handling and installation during PCB assembly processes.

CPU Family: CORTEX-M3

Provides a reliable and efficient processing platform for embedded system applications.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme temperature environments without compromising performance.

ADC Channels: YES

Enables analog-to-digital conversion capability for interfacing with external sensors and devices.

ROM Words: 131072

Offers ample storage capacity for program instructions and data.

Technology: CMOS

Ensures low power consumption and efficient operation for extended battery life.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

Connectivity: I2C, SSI(2), UART(2), USB

Facilitates communication with other devices and systems through multiple interfaces.

Technical Specifications

Microcontrollers LM3S3634-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI(2), UART(2), USB

Peripherals:

DMA, TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S3634-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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