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LM3S317-IGZ25-C2T

Texas Instruments

LM3S317-IGZ25-C2T by Texas Instruments

Texas Instruments LM3S317-IGZ25-C2T is a 32-bit microcontroller with 3.3V power supply, 16384 ROM words, and 4096 RAM bytes. Ideal for industrial applications, it features 30 I/O lines, PWM channels, and ADC channels for versatile functionality in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,242 parts In-Stock

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3,242

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Digiode

USA . 1,715 parts In-Stock

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1,715

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One Stop Electronics

USA . 481 parts In-Stock

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$10.000

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481

$10.000

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AZTECH Wire

Italy . 422 parts In-Stock

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$11.180

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422

$11.180

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Parana Technologies

USA . 749 parts In-Stock

1+ parts

$73.479

100+ parts

$6,823.667

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$66.131

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749

$73.479

$6,823.667

$66.131

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DigiPath Technology Company

USA . 330 parts In-Stock

1+ parts

$80.910

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$74.437

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330

$80.910

$74.437

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ChromeModa Solutions

Germany . 6,455 parts In-Stock

1+ parts

$82.561

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$67.700

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6,455

$82.561

$67.700

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IDEA Electronic Components Group

UK . 516 parts In-Stock

1+ parts

$82.561

100+ parts

$78.433

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$74.305

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516

$82.561

$78.433

$74.305

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QUARKTWIN TECHNOLOGY LTD

USA . 17,293 parts In-Stock

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Corphita

USA . 4,798 parts In-Stock

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Microchip USA

USA . 4,030 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S317-IGZ25-C2T by Texas Instruments, a top-of-the-line microcontroller designed to deliver unparalleled performance and reliability. As a leading manufacturer in the industry, Texas Instruments ensures that this product meets the highest standards of quality, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers exceptional value, benefits, and advantages to customers seeking cutting-edge technology. Experience innovation like never before with the LM3S317-IGZ25-C2T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient assembly onto a PCB, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape makes it easy to mount and align on the PCB, improving overall mechanical stability.

Bit Size: 32

32-bit architecture allows for more complex calculations and processing capabilities compared to lower bit sizes.

Power Supplies (V): 3.3

Standard power supply voltage of 3.3V, widely used in many electronic systems.

No. of Terminals: 48

Ample number of terminals provide flexibility for input/output connections and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 3 V

Can operate at a relatively low supply voltage, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in harsh environments or extreme conditions.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion, expanding the range of sensors and devices that can be interfaced.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection on the PCB, reducing the risk of disconnection or short circuits.

ROM Words: 16384

Ample ROM capacity for storing program instructions and data, enabling complex algorithms and operations to be implemented.

Maximum Seated Height: 1 mm

Low seated height allows for compact and slim product designs, suitable for space-constrained applications.

Width: 6.875 mm

Compact width size enables efficient use of PCB space and facilitates integration into small form factor devices.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing and data transfer speeds, improving overall system performance.

Length: 6.875 mm

Compact length size helps in creating smaller product footprints and optimizing PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with varying temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient and fast processing capabilities for a wide range of applications.

RAM Bytes: 4096

Sufficient RAM storage for temporary data and variables, enabling smooth execution of complex algorithms and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated and noise-sensitive applications.

Terminal Form: NO LEAD

No-lead terminal form ensures reliable solder connections and reduces the risk of solder joint failures.

Maximum Supply Current: 65 mA

Moderate supply current requirement ensures efficient power consumption and prevents overheating issues.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Built-in PWM channels enable precise control of motor speeds, LED brightness, and other analog output signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications without the need for external programming hardware.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB layouts and integration of multiple components within a limited space.

Speed: 25 rpm

Operating speed of 25 RPM provides fast data processing and response times, suitable for real-time applications and control systems.

No. of I/O Lines: 30

Sufficient number of I/O lines for connecting external devices, sensors, and peripherals, making it versatile for various applications.

Technical Specifications

Microcontrollers LM3S317-IGZ25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S317-IGZ25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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