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LM3S317-EGZ25-C2

Texas Instruments

LM3S317-EGZ25-C2 by Texas Instruments

LM3S317-EGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at up to 25 MHz. It features 4096 bytes of RAM, 16384 ROM words, and supports PWM channels. Ideal for industrial applications requiring a max supply voltage of 3.6 V and an operating temperature range from -40°C to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,700 parts In-Stock

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4,700

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Digiode

USA . 2,576 parts In-Stock

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2,576

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Distributors (Availability)

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One Stop Electronics

USA . 1,609 parts In-Stock

1+ parts

$7.000

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1,609

$7.000

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AZTECH Wire

Italy . 342 parts In-Stock

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$12.743

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342

$12.743

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Parana Technologies

USA . 111 parts In-Stock

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$71.010

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111

$71.010

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ChromeModa Solutions

Germany . 3,528 parts In-Stock

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$79.787

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$65.425

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3,528

$79.787

$65.425

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$79.787

100+ parts

$75.798

1k+ parts

$71.808

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1,078

$79.787

$75.798

$71.808

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Corphita

USA . 3,263 parts In-Stock

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3,263

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Microchip USA

USA . 2,241 parts In-Stock

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DigiPath Technology Company

USA . 2,137 parts In-Stock

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$71.936

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2,137

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$71.936

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Overview

Experience the power of innovation with the LM3S317-EGZ25-C2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. With features like 32-bit processing, advanced ADC channels, and Flash ROM programmability, this product offers unmatched value and benefits to customers. Whether you're working on industrial automation, consumer electronics, or IoT projects, the LM3S317-EGZ25-C2 is the perfect choice to bring your ideas to life. Trust Texas Instruments for reliability, performance, and excellence.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within specified limits.

Package Shape: SQUARE

Square package shape is often more stable and easier to mount compared to irregular shapes, enhancing reliability.

Bit Size: 32

32-bit architecture allows for efficient processing of data and instructions, suitable for a wide range of applications.

Power Supplies (V): 3.3

Operates within a common voltage range, making it compatible with standard power sources.

No. of Terminals: 48

Sufficient number of terminals for connecting multiple components and peripherals, enhancing versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Diverse package styles offer flexibility in design and thermal management, catering to different application requirements.

Minimum Supply Voltage: 3 V

Ensures reliable operation at lower voltage levels, providing power efficiency and compatibility with various systems.

Maximum Operating Temperature: 105 °C

Wide operating temperature range allows for reliable performance in various environmental conditions, increasing product durability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, ensuring reliable operation in harsh environments.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making the microcontroller suitable for sensor applications and data acquisition.

Terminal Position: QUAD

Quad-terminal layout facilitates easier circuit design and connections, enhancing ease of use and reliability.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of program code and data, supporting complex applications.

Maximum Seated Height: 1 mm

Low-profile design enables compact integration in space-constrained applications, optimizing board layout and system form factor.

Width: 6.875 mm

Narrow width saves space on the PCB and allows for efficient board routing, improving overall design efficiency.

Maximum Clock Frequency: 25 MHz

High clock frequency supports fast processing speeds, making the microcontroller suitable for real-time applications and rapid data processing.

Length: 6.875 mm

Compact length contributes to space-saving design and efficient use of board real estate, ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in rugged environments and industrial applications, enhancing product robustness.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction and data handling, enabling high-performance computing in embedded systems.

RAM Bytes: 4096

Adequate RAM capacity supports temporary data storage and multitasking, enabling efficient execution of tasks and algorithms.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing energy efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and industry standards, promoting sustainability and safety.

Maximum Supply Current: 65 mA

Moderate supply current consumption ensures efficient power usage and prolongs battery life in portable devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and prevents damage from voltage fluctuations, enhancing product reliability.

PWM Channels: YES

Integrated PWM channels support precise control of analog outputs, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

FLASH ROM allows for easy reprogramming and updating of firmware, facilitating product customization and maintenance.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density integration and miniaturization of PCB designs, enhancing versatility in application layouts.

Speed: 25 rpm

High speed capability supports fast processing and responsive operation, suitable for time-critical applications and high-speed interfaces.

No. of I/O Lines: 30

Sufficient number of I/O lines enable versatile connectivity with external devices and peripherals, enhancing flexibility in system design and functionality.

Technical Specifications

Microcontrollers LM3S317-EGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S317-EGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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