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LM3S315-EQN25-C2T

Texas Instruments

LM3S315-EQN25-C2T by Texas Instruments

LM3S315-EQN25-C2T by Texas Instruments is a 32-bit microcontroller with 16384 ROM words, 4096 RAM bytes, and 32 I/O lines. It operates at a max clock frequency of 25 MHz and has PWM channels for industrial applications requiring high-speed processing in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,498 parts In-Stock

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Digiode

USA . 4,438 parts In-Stock

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4,438

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Distributors (Availability)

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AZTECH Wire

Italy . 692 parts In-Stock

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$9.805

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One Stop Electronics

USA . 1,400 parts In-Stock

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$33.000

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$33.000

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Parana Technologies

USA . 1,944 parts In-Stock

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$47.121

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$47.121

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DigiPath Technology Company

USA . 2,070 parts In-Stock

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$51.886

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2,070

$51.886

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ChromeModa Solutions

Germany . 3,922 parts In-Stock

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$52.945

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$43.415

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3,922

$52.945

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IDEA Electronic Components Group

UK . 702 parts In-Stock

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$52.945

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$50.298

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$47.650

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702

$52.945

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$47.650

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Corphita

USA . 1,664 parts In-Stock

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Microchip USA

USA . 493 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S315-EQN25-C2T microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller provides unmatched performance and efficiency. Experience seamless integration and advanced features that cater to all your needs. Upgrade your projects with the LM3S315-EQN25-C2T and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options while remaining within safe operating limits.

Package Shape: SQUARE

Square package shape enables compact and space-saving design for the microcontroller, ideal for applications with limited space constraints.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, allowing for complex calculations and multitasking.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures consistent and reliable performance of the microcontroller.

No. of Terminals: 48

Higher number of terminals allows for greater connectivity options and interface capabilities with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enables easy mounting and soldering, making it suitable for compact designs.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for efficient power consumption, suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality in extreme cold conditions, providing versatility in use.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, extending its usage in diverse applications.

Terminal Position: QUAD

Quad terminal position allows for efficient connectivity and mounting, enhancing the ease of installation and integration.

ROM Words: 16384

Large ROM capacity of 16384 words provides ample storage for program instructions and data, enabling versatile programming options.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for slim and compact device design, suitable for space-constrained applications.

Width: 7 mm

Narrow width of 7mm offers space-saving benefits and allows for efficient placement on circuit boards.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz enables fast processing and response times, ideal for real-time applications.

Length: 7mm

Short length of 7mm contributes to the compact and space-efficient design of the microcontroller, suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh conditions, making it suitable for demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller provides efficient processing and reduced instruction complexity, enhancing performance.

RAM Bytes: 4096

Generous RAM capacity of 4096 bytes allows for efficient data storage and manipulation, supporting complex computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust electrical connections, ensuring the durability of the microcontroller.

Maximum Supply Current: 65 mA

Moderate maximum supply current of 65 mA ensures efficient power usage and prevents overheating, enhancing the overall reliability of the microcontroller.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog signals, enabling fine-tuning of output signals and enhanced functionality.

ROM Programmability: FLASH

Flash ROM programmability provides flexibility for reprogramming and updating the microcontroller, facilitating easy updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and efficient connectivity on circuit boards, contributing to compact design.

Speed: 25 rpm

High speed of 25 rpm allows for fast data processing and response times, making the microcontroller suitable for time-sensitive applications.

No. of I/O Lines: 32

Abundant I/O lines provide versatile connectivity options for interfacing with external sensors, actuators, and peripherals, enhancing the functionality of the microcontroller.

Technical Specifications

Microcontrollers LM3S315-EQN25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S315-EQN25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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