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LM3S315-EQN25-C2

Texas Instruments

LM3S315-EQN25-C2 by Texas Instruments

Texas Instruments LM3S315-EQN25-C2 is a 32-bit microcontroller with 16384 ROM words, 4096 RAM bytes, and 32 I/O lines. Operating at up to 25 MHz with a supply voltage of 3.3 V, it's ideal for industrial applications requiring PWM channels and ADC functionality. The compact square package with low profile design makes it suitable for space-constrained projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,210 parts In-Stock

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7,210

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Digiode

USA . 1,587 parts In-Stock

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1,587

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Distributors (Availability)

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AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$16.194

100+ parts

-

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225

$16.194

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One Stop Electronics

USA . 522 parts In-Stock

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$29.000

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522

$29.000

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Parana Technologies

USA . 815 parts In-Stock

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$55.377

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815

$55.377

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DigiPath Technology Company

USA . 1,628 parts In-Stock

1+ parts

$60.977

100+ parts

$56.098

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1,628

$60.977

$56.098

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ChromeModa Solutions

Germany . 4,621 parts In-Stock

1+ parts

$62.221

100+ parts

$51.021

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4,621

$62.221

$51.021

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IDEA Electronic Components Group

UK . 551 parts In-Stock

1+ parts

$62.221

100+ parts

$59.110

1k+ parts

$55.999

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551

$62.221

$59.110

$55.999

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Corphita

USA . 2,345 parts In-Stock

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Microchip USA

USA . 461 parts In-Stock

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461

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Overview

Experience the power of innovation with the LM3S315-EQN25-C2 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. Ideal for a wide range of applications, this microcontroller offers exceptional value with its 32-bit architecture, advanced features, and high performance. Unlock endless possibilities and streamline your projects with the LM3S315-EQN25-C2. Upgrade your technology game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, making the product cost-effective.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages without risk of damage, providing flexibility in design and usage.

Bit Size: 32

Large bit size allows for processing more data at once, enhancing the performance of the microcontroller.

No. of Terminals: 48

Having more terminals provides greater connectivity options and interfaces for peripherals, increasing versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for high-speed processing and efficient use of resources, making the microcontroller suitable for demanding applications.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing speeds, improving overall performance of the microcontroller.

RAM Bytes: 4096

Ample memory capacity for data storage and processing, ensuring smooth operation of the microcontroller.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Maximum Supply Current: 65 mA

Low supply current requirement contributes to energy efficiency and minimizes power consumption, extending battery life.

Technical Specifications

Microcontrollers LM3S315-EQN25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S315-EQN25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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