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LM3S315-EGZ25-C2

Texas Instruments

LM3S315-EGZ25-C2 by Texas Instruments

LM3S315-EGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 25MHz clock frequency, and 4096 bytes of RAM. Ideal for industrial applications requiring high-speed processing, it features ADC and PWM channels, along with flash ROM programmability for versatile functionality in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,499 parts In-Stock

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5,499

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Digiode

USA . 4,246 parts In-Stock

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4,246

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$7.615

100+ parts

-

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802

$7.615

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One Stop Electronics

USA . 1,482 parts In-Stock

1+ parts

$34.000

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1,482

$34.000

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Parana Technologies

USA . 1,683 parts In-Stock

1+ parts

$57.902

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1,683

$57.902

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DigiPath Technology Company

USA . 879 parts In-Stock

1+ parts

$63.757

100+ parts

$58.656

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879

$63.757

$58.656

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ChromeModa Solutions

Germany . 3,133 parts In-Stock

1+ parts

$65.058

100+ parts

$53.348

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3,133

$65.058

$53.348

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IDEA Electronic Components Group

UK . 73 parts In-Stock

1+ parts

$65.058

100+ parts

$61.805

1k+ parts

$58.552

10k+ parts

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73

$65.058

$61.805

$58.552

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Corphita

USA . 4,714 parts In-Stock

1+ parts

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4,714

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Microchip USA

USA . 1,400 parts In-Stock

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1,400

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Overview

Unlock the power of innovation with the LM3S315-EGZ25-C2 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. Ideal for a wide range of applications, this microcontroller provides unmatched performance and efficiency. With features like PWM channels, ADC channels, and a 32-bit architecture, this product offers exceptional value to customers looking to take their projects to the next level. Choose Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering, making the product suitable for automated assembly processes.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product can handle higher voltage inputs, providing a wider operating range.

Package Shape: SQUARE

The square package shape helps in optimizing PCB space and layout, making the product more compact and easy to integrate into designs.

Bit Size: 32

Having a 32-bit architecture allows for handling larger data sizes and more complex algorithms, enabling high performance and efficiency.

Power Supplies (V): 3.3

The availability of multiple power supplies at 3.3V ensures stable and reliable operation of the product in various applications.

No. of Terminals: 48

The ample number of terminals enable the product to interface with a wide range of external devices and peripherals, enhancing its versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide flexibility for different mounting and cooling requirements, catering to diverse application environments.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V allows for operation in low-power scenarios while maintaining reliable functionality.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the product's resilience in harsh environmental conditions, offering reliable performance under extreme heat.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively even in cold climates or refrigerated environments.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, facilitating sensor interfacing and data acquisition for various applications.

Terminal Position: QUAD

The quad terminal positioning simplifies PCB layout and connectivity, ensuring efficient signal routing and overall system integration.

ROM Words: 16384

With 16384 ROM words, the product offers sufficient memory capacity for storing program instructions and data, supporting complex algorithms and applications.

Maximum Seated Height: 1 mm

The low maximum seated height makes the product suitable for compact designs and applications with height constraints, ensuring space-efficient integration.

Width: 6.875 mm

The moderate width of 6.875mm allows for easy placement on PCBs and facilitates efficient board layout, contributing to streamlined design processes.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz enables fast processing speeds and real-time operations, ensuring responsive performance in demanding applications.

Length: 6.875 mm

The length of 6.875mm complements the width, contributing to a compact form factor and efficient use of PCB space, enhancing the product's overall design flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the product can withstand harsh industrial environments and operating conditions, ensuring long-term reliability and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC-based microcontroller, the product offers efficient processing capabilities and streamlined instruction execution, enhancing overall system performance.

RAM Bytes: 4096

With 4096 bytes of RAM, the product provides ample memory for temporary data storage, facilitating efficient data processing and multitasking capabilities.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making the product energy-efficient and robust in various applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering processes and enhances thermal performance, improving reliability and overall connection integrity.

Maximum Supply Current: 65 mA

With a maximum supply current of 65mA, the product consumes low power, making it suitable for battery-powered or energy-efficient applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures stable and efficient performance, making the product compatible with standard power sources and systems.

PWM Channels: YES

The availability of PWM channels enables precise control of analog outputs, supporting applications such as motor control, LED dimming, and power regulation.

ROM Programmability: FLASH

Featuring flash ROM programmability, the product allows for easy firmware updates and reprogramming, ensuring flexibility and adaptability in changing application requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables compact PCB designs and efficient board layout, supporting high-density integration and miniaturization.

Speed: 25 rpm

Operating at a speed of 25 rpm, the product delivers fast and responsive performance for various motor control and speed regulation applications.

No. of I/O Lines: 32

With 32 I/O lines, the product offers ample interfacing options for connecting external devices and peripherals, enhancing connectivity and versatility in system design.

Technical Specifications

Microcontrollers LM3S315-EGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S315-EGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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