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LM3S310-IGZ25-C2

Texas Instruments

LM3S310-IGZ25-C2 by Texas Instruments

LM3S310-IGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 4096 RAM bytes, and 16384 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a reliable RISC-based microcontroller with PWM channels and ADC capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,010 parts In-Stock

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Digiode

USA . 1,767 parts In-Stock

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One Stop Electronics

USA . 1,220 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 831 parts In-Stock

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$17.349

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Parana Technologies

USA . 1,216 parts In-Stock

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$35.262

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ChromeModa Solutions

Germany . 5,954 parts In-Stock

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$39.620

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$32.488

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IDEA Electronic Components Group

UK . 381 parts In-Stock

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$39.620

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$37.639

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$35.658

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$35.658

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Microchip USA

USA . 2,290 parts In-Stock

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DigiPath Technology Company

USA . 993 parts In-Stock

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$35.721

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Corphita

USA . 146 parts In-Stock

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A-Z Elektronik GmbH

Germany . 126 parts In-Stock

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Kepictronics

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Overview

Unlock the power of innovation with the LM3S310-IGZ25-C2 microcontroller by Texas Instruments. Built with precision and expertise, this cutting-edge product offers unmatched performance and reliability in a compact size. Ideal for a wide range of applications, from industrial controls to consumer electronics, this versatile microcontroller delivers seamless operation and efficiency. Experience the value and benefits that Texas Instruments brings to the table with the LM3S310-IGZ25-C2, setting new standards in quality and functionality. Elevate your projects to the next level with this exceptional microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this microcontroller a convenient choice for manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wider range of applications.

Package Shape: SQUARE

The square package shape simplifies placement and orientation on the PCB, making it easier to design and integrate into circuit layouts.

Bit Size: 32

A 32-bit architecture provides improved performance and efficiency compared to lower bit sizes, making this microcontroller suitable for demanding computing tasks.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V ensures compatibility with common power sources and peripherals, enhancing ease of integration.

No. of Terminals: 48

Having a higher number of terminals allows for more I/O connections, enabling greater versatility in interfacing with external devices and sensors.

ROM Words: 16384

With a large ROM capacity, this microcontroller can store more program instructions, making it suitable for applications that require extensive code storage.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

RAM Bytes: 4096

A generous amount of RAM capacity ensures efficient data processing and manipulation, supporting complex algorithms and multitasking operations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller enhances processing speed and efficiency, making it suitable for applications that require real-time responsiveness.

ROM Programmability: FLASH

Flash ROM programmability offers reusability and flexibility in updating firmware, allowing for easy maintenance and future-proofing of the product.

Technical Specifications

Microcontrollers LM3S310-IGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S310-IGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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