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LM3S310-EQN25-C2

Texas Instruments

LM3S310-EQN25-C2 by Texas Instruments

LM3S310-EQN25-C2 by Texas Instruments is a 32-bit microcontroller with 16384 ROM words and 4096 RAM bytes. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With features like PWM channels and ADC channels, this microcontroller is ideal for embedded systems that demand precise analog-to-digital conversion and pulse-width modulation functionalities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,526 parts In-Stock

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Digiode

USA . 1,696 parts In-Stock

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1,696

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Distributors (Availability)

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One Stop Electronics

USA . 1,628 parts In-Stock

1+ parts

$4.000

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$4.000

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AZTECH Wire

Italy . 636 parts In-Stock

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$12.363

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636

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Parana Technologies

USA . 1,199 parts In-Stock

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$64.634

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$64.634

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DigiPath Technology Company

USA . 2,261 parts In-Stock

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$71.170

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2,261

$71.170

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ChromeModa Solutions

Germany . 2,343 parts In-Stock

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$72.622

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$59.550

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2,343

$72.622

$59.550

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

1+ parts

$72.622

100+ parts

$68.991

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$65.360

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1,212

$72.622

$68.991

$65.360

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Corphita

USA . 4,657 parts In-Stock

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Microchip USA

USA . 456 parts In-Stock

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Overview

Upgrade your projects with the Texas Instruments LM3S310-EQN25-C2 microcontroller, a top-of-the-line device that offers unmatched quality and reliability. With a 32-bit architecture and advanced features, this microcontroller is ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile product delivers exceptional performance and efficiency. Trust Texas Instruments, a leading manufacturer known for its innovative technology, to provide you with the tools you need to bring your ideas to life. Experience the value and benefits of the LM3S310-EQN25-C2 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good durability and protection.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape is easy to handle and provides uniformity in PCB layout.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle more complex operations and calculations.

Power Supplies (V): 3.3

Standard power supply voltage, suitable for many applications.

No. of Terminals: 48

Sufficient number of terminals for connecting various peripherals and components.

Package Style (Meter): FLATPACK

Flatpack style allows for compact and space-saving design.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltages, saving power and increasing efficiency.

Maximum Operating Temperature: 105 °C

Can operate in high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments, providing versatility in use cases.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position allows for easy connection and soldering on the PCB.

ROM Words: 16384

Ample ROM capacity for storing program code and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact PCB layouts.

Width: 7 mm

Narrow width for saving space on the PCB.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing and real-time applications.

Length: 7 mm

Short length for compact PCB designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and durability are crucial.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient execution of instructions and improved performance.

RAM Bytes: 4096

Sufficient RAM capacity for temporary data storage and efficient processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide reliable connections and ease of soldering.

Maximum Supply Current: 65 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Narrow terminal pitch for compact PCB design and high-density mounting.

Speed: 25 rpm

High processing speed for quick response and efficient operation.

No. of I/O Lines: 36

Sufficient number of I/O lines for connecting external devices and peripherals.

Technical Specifications

Microcontrollers LM3S310-EQN25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S310-EQN25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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