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LM3S310-EGZ25-C2T

Texas Instruments

LM3S310-EGZ25-C2T by Texas Instruments

LM3S310-EGZ25-C2T by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 4096 bytes of RAM, and 16384 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a high-speed RISC microcontroller with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,165 parts In-Stock

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Digiode

USA . 4,922 parts In-Stock

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4,922

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Distributors (Availability)

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AZTECH Wire

Italy . 546 parts In-Stock

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$12.948

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546

$12.948

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One Stop Electronics

USA . 1,472 parts In-Stock

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$31.000

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Parana Technologies

USA . 645 parts In-Stock

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$72.128

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645

$72.128

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ChromeModa Solutions

Germany . 4,519 parts In-Stock

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$81.043

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$66.455

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4,519

$81.043

$66.455

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IDEA Electronic Components Group

UK . 1,581 parts In-Stock

1+ parts

$81.043

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$76.991

1k+ parts

$72.939

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1,581

$81.043

$76.991

$72.939

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Microchip USA

USA . 2,938 parts In-Stock

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2,938

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DigiPath Technology Company

USA . 1,844 parts In-Stock

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$73.068

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Corphita

USA . 677 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S310-EGZ25-C2T microcontroller by Texas Instruments. As a leader in quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is ideal for a wide range of applications, offering customers unmatched value, efficiency, and performance. Elevate your projects with the LM3S310-EGZ25-C2T and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, saving space and reducing assembly costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, providing flexibility in different applications.

Package Shape: SQUARE

The square package shape is easy to mount and align on a PCB, simplifying the manufacturing process.

Bit Size: 32

A 32-bit architecture enables this microcontroller to handle complex computations and data processing efficiently.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with a wide range of power sources and peripherals.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance, making it suitable for industrial applications with demanding operating conditions.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures that the microcontroller can operate reliably even with fluctuating power sources.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to function in extremely cold environments without performance degradation.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels enables the microcontroller to convert analog signals from sensors or external devices into digital data for processing.

Terminal Position: QUAD

The quad terminal position layout provides efficient routing of connections on the PCB, reducing signal interference and improving reliability.

ROM Words: 16384

With 16384 ROM words, this microcontroller has sufficient memory capacity to store program code and data for various applications.

Maximum Seated Height: 1 mm

The low maximum seated height profile makes this microcontroller suitable for compact electronic devices and applications with space constraints.

Width: 6.875 mm

The narrow width allows for efficient placement of multiple components on a PCB, optimizing board space and layout.

Maximum Clock Frequency: 0.032 MHz

Operating at a high maximum clock frequency of 32 MHz enables fast and responsive performance for time-critical applications.

Length: 6.875 mm

The compact length of the microcontroller contributes to space-saving designs and allows for flexibility in PCB layout.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliable operation in harsh environments with temperature fluctuations and high heat.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient data processing and execution, enhancing overall performance and responsiveness.

RAM Bytes: 4096

Having 4096 bytes of RAM allows the microcontroller to store and manipulate data during program execution, facilitating efficient multitasking and data processing.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and high speed operation for optimized performance.

Terminal Form: NO LEAD

The no-lead terminal form factor simplifies the assembly process and ensures reliable connections, reducing the risk of soldering defects and PCB damage.

Maximum Supply Current: 65 mA

With a maximum supply current of 65 mA, this microcontroller operates efficiently without drawing excessive power, making it suitable for battery-powered devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent operation of the microcontroller, delivering reliable performance in various applications.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of motor speed, LED brightness, and other applications requiring variable output signals.

ROM Programmability: FLASH

Use of Flash ROM allows for easy reprogramming and updating of firmware, enhancing flexibility and adaptability for changing application requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling compact and efficient designs with enhanced signal integrity.

Speed: 25 rpm

With a speed of 25 rotations per minute, this microcontroller can handle real-time processing tasks and high-speed communication interfaces effectively.

No. of I/O Lines: 36

Having 36 Input/Output (I/O) lines provides ample connectivity options for interfacing with external devices, sensors, and actuators, making it versatile for different applications.

Technical Specifications

Microcontrollers LM3S310-EGZ25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S310-EGZ25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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