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LM3S310-EGZ25-C2

Texas Instruments

LM3S310-EGZ25-C2 by Texas Instruments

LM3S310-EGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 4096 bytes of RAM, and 16384 ROM words. It operates at a max clock frequency of 0.032 MHz and has PWM channels for various industrial applications. With a package style of CHIP CARRIER and terminal pitch of 0.5 mm, it is suitable for surface mount assembly in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,358 parts In-Stock

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8,358

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Digiode

USA . 506 parts In-Stock

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506

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Distributors (Availability)

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$14.372

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786

$14.372

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One Stop Electronics

USA . 1,174 parts In-Stock

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$28.000

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1,174

$28.000

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Parana Technologies

USA . 39 parts In-Stock

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$39.342

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39

$39.342

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ChromeModa Solutions

Germany . 1,450 parts In-Stock

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$44.204

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$36.247

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1,450

$44.204

$36.247

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IDEA Electronic Components Group

UK . 123 parts In-Stock

1+ parts

$44.204

100+ parts

$41.994

1k+ parts

$39.784

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123

$44.204

$41.994

$39.784

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Microchip USA

USA . 1,596 parts In-Stock

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Corphita

USA . 1,362 parts In-Stock

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DigiPath Technology Company

USA . 1,174 parts In-Stock

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$39.854

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1,174

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$39.854

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Overview

Unleash the limitless possibilities of technology with the LM3S310-EGZ25-C2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that offer unmatched performance and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value, benefits, and advantages. From its innovative design to its seamless functionality, the LM3S310-EGZ25-C2 is the perfect solution for all your microcontroller needs. Experience excellence at its finest with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

Support for a higher supply voltage allows for flexibility in system design and compatibility with various power sources.

Package Shape: SQUARE

Square packages often provide better thermal performance and space utilization compared to other shapes, leading to improved reliability and compact designs.

Bit Size: 32

A 32-bit architecture enables faster processing and better performance for complex tasks compared to lower-bit microcontrollers.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures consistent operation and compatibility with a wide range of peripheral components.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with sensors, actuators, and other external devices in a system.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer high reliability and good thermal performance, making them suitable for industrial applications where ruggedness is required.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures compatibility with a wide range of power sources and reduces the risk of voltage fluctuations affecting operation.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and industrial applications without overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance in cold environments and extended temperature range applications.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition and control applications.

Terminal Position: QUAD

Quad terminal position helps in efficient routing of connections on the PCB, reducing signal interference and improving overall reliability of the system.

ROM Words: 16384

With 16,384 ROM words, this microcontroller offers sufficient memory for storing program instructions and data, enabling complex algorithms and applications to be executed.

Maximum Seated Height: 1 mm

A low maximum seated height of 1mm allows for compact and slim designs, making this microcontroller suitable for space-constrained applications.

Width: 6.875 mm

The compact width of 6.875mm enables easy integration into small electronic devices, saving valuable PCB real estate and reducing overall size of the product.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32kHz enables rapid execution of instructions and real-time processing of data, making it suitable for time-critical tasks.

Length: 6.875 mm

The length of 6.875mm provides a balanced form factor for the microcontroller, allowing for efficient placement on the PCB and reducing signal propagation delays.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with wide temperature fluctuations, making it suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance, low power consumption, and efficient code execution, making it ideal for embedded control applications.

RAM Bytes: 4096

With 4,096 bytes of RAM, this microcontroller provides sufficient memory for temporary data storage and buffer operations, enhancing the efficiency of data processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this microcontroller energy-efficient and reliable for battery-powered devices.

Terminal Form: NO LEAD

No lead terminal form simplifies the assembly process, reduces the risk of soldering defects, and improves the overall reliability of the product.

Maximum Supply Current: 65 mA

With a maximum supply current of 65mA, this microcontroller operates within a low power consumption range, making it suitable for battery-operated and portable devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard power sources, reducing the risk of voltage fluctuations affecting operation.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog output signals such as motor speed and LED brightness, expanding the application range of this microcontroller.

ROM Programmability: FLASH

Flash programmable ROM allows for easy reprogramming of firmware and updates, enhancing the flexibility and versatility of the microcontroller for evolving system requirements.

Terminal Pitch: 0.5 mm

With a compact terminal pitch of 0.5mm, this microcontroller provides high-density interconnects for efficient PCB layout and space-saving designs.

Speed: 25 rpm

Operating speed of 25 rotations per minute (rpm) indicates the processing capacity and efficiency of this microcontroller in handling tasks and responding to inputs in real time.

No. of I/O Lines: 36

Having 36 input/output lines offers ample connectivity options for interfacing with external devices and peripherals, making this microcontroller versatile for a wide range of applications.

Technical Specifications

Microcontrollers LM3S310-EGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S310-EGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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