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LM3S308-EQN25-C2T

Texas Instruments

LM3S308-EQN25-C2T by Texas Instruments

LM3S308-EQN25-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 25 MHz. It features 4096 bytes of RAM and 16384 ROM words, suitable for industrial applications requiring high-speed processing and PWM functionality. With a low profile package style and moisture sensitivity level of 3, it offers versatile performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,973 parts In-Stock

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3,973

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Vyrian

USA . 2,136 parts In-Stock

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2,136

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Distributors (Availability)

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AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$8.250

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654

$8.250

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One Stop Electronics

USA . 1,342 parts In-Stock

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$25.000

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1,342

$25.000

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Parana Technologies

USA . 2,075 parts In-Stock

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$45.820

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2,075

$45.820

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DigiPath Technology Company

USA . 1,760 parts In-Stock

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$50.453

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$46.417

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1,760

$50.453

$46.417

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ChromeModa Solutions

Germany . 4,016 parts In-Stock

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$51.483

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$42.216

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4,016

$51.483

$42.216

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$51.483

100+ parts

$48.909

1k+ parts

$46.335

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1,353

$51.483

$48.909

$46.335

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Corphita

USA . 698 parts In-Stock

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698

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Microchip USA

USA . 421 parts In-Stock

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421

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Overview

Elevate your electronic projects to the next level with the LM3S308-EQN25-C2T by Texas Instruments, a top-of-the-line microcontroller that delivers unparalleled quality and performance. As a trusted manufacturer in the industry, Texas Instruments ensures reliability and innovation in all their products. This microcontroller is perfect for a wide range of applications, offering customers a versatile solution for their electronic design needs. Experience the value and benefits of this cutting-edge technology, providing you with the advantage you need to bring your ideas to life. Choose Texas Instruments for excellence in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and heat resistance, making the microcontroller suitable for various operating conditions.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Offers a wide supply voltage range, ensuring compatibility with different power sources.

Bit Size: 32

Provides a high processing capability, enabling complex calculations and data manipulation tasks.

Power Supplies (V): 3.3

Stable power supply voltage ensures reliable operation of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact design and efficient heat dissipation for better performance in limited spaces.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with various sensors and other analog devices.

ROM Words: 16384

Offers ample storage capacity for program instructions and data, accommodating larger and more complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for improved efficiency and faster execution of instructions.

RAM Bytes: 4096

Provides sufficient memory for temporary data storage and processing, enhancing the overall performance of the microcontroller.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity, prolonging the battery life of portable devices.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) for precise control of signals, ideal for applications such as motor control and LED dimming.

Technical Specifications

Microcontrollers LM3S308-EQN25-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S308-EQN25-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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