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LM3S301-IQN20-C2T

Texas Instruments

LM3S301-IQN20-C2T by Texas Instruments

Texas Instruments' LM3S301-IQN20-C2T is a 32-bit microcontroller with 3.3V power supply, 2048 bytes of RAM, and 16384 ROM words. Ideal for industrial applications, it operates b/w -40 to 85°C, features 33 I/O lines, and supports up to 20 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,017 parts In-Stock

1+ parts

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3,017

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Digiode

USA . 2,830 parts In-Stock

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2,830

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,561 parts In-Stock

1+ parts

$11.000

100+ parts

-

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1,561

$11.000

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AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$17.575

100+ parts

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669

$17.575

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Microchip USA

USA . 3,420 parts In-Stock

1+ parts

$25.390

100+ parts

$25.230

1k+ parts

$25.150

10k+ parts

$25.080

3,420

$25.390

$25.230

$25.150

$25.080

Parana Technologies

USA . 1,723 parts In-Stock

1+ parts

$35.442

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1,723

$35.442

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DigiPath Technology Company

USA . 976 parts In-Stock

1+ parts

$39.026

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976

$39.026

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ChromeModa Solutions

Germany . 2,366 parts In-Stock

1+ parts

$39.822

100+ parts

$32.654

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2,366

$39.822

$32.654

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IDEA Electronic Components Group

UK . 174 parts In-Stock

1+ parts

$39.822

100+ parts

$37.831

1k+ parts

$35.840

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174

$39.822

$37.831

$35.840

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Corphita

USA . 309 parts In-Stock

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309

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the LM3S301-IQN20-C2T microcontroller. This versatile device is perfect for a wide range of applications, offering customers unmatched value and performance. With advanced features and a high clock frequency, this microcontroller is ideal for industrial use, providing seamless operation in challenging environments. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Upgrade your project with the LM3S301-IQN20-C2T and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in different operating conditions.

Package Shape: SQUARE

Square shape helps in efficient use of PCB space and component placement.

Bit Size: 32

32-bit architecture allows for higher processing capabilities and performance compared to lower bit sizes.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage level of 3.3V, ensuring compatibility with common power sources.

No. of Terminals: 48

Provides a sufficient number of terminals for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch contributes to space-saving and high-density PCB layouts.

Minimum Supply Voltage: 3 V

Supports a low minimum supply voltage, enabling operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures without performance degradation, suitable for industrial applications.

Technical Specifications

Microcontrollers LM3S301-IQN20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S301-IQN20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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