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LM3S301-IGZ20-C2T

Texas Instruments

LM3S301-IGZ20-C2T by Texas Instruments

Texas Instruments LM3S301-IGZ20-C2T is a 32-bit microcontroller with 16384 ROM words, 2048 RAM bytes, and 33 I/O lines. Operating at up to 20 MHz, it features PWM channels and ADC support. Ideal for industrial applications requiring a compact chip carrier package with a max clock frequency of 20 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,214 parts In-Stock

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3,214

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Vyrian

USA . 2,610 parts In-Stock

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2,610

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Distributors (Availability)

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$14.743

100+ parts

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817

$14.743

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One Stop Electronics

USA . 606 parts In-Stock

1+ parts

$21.000

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606

$21.000

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Parana Technologies

USA . 227 parts In-Stock

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$57.795

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227

$57.795

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DigiPath Technology Company

USA . 104 parts In-Stock

1+ parts

$63.639

100+ parts

$58.548

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104

$63.639

$58.548

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ChromeModa Solutions

Germany . 2,618 parts In-Stock

1+ parts

$64.938

100+ parts

$53.249

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2,618

$64.938

$53.249

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IDEA Electronic Components Group

UK . 1,083 parts In-Stock

1+ parts

$64.938

100+ parts

$61.691

1k+ parts

$58.444

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1,083

$64.938

$61.691

$58.444

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Microchip USA

USA . 1,619 parts In-Stock

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Corphita

USA . 1,161 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S301-IGZ20-C2T microcontroller. Perfect for a wide range of applications, this high-quality device offers exceptional performance and reliability. With a maximum clock frequency of 20 MHz and 32-bit processing power, this microcontroller is designed to meet your needs efficiently. Say goodbye to slow processing speeds and hello to seamless operation with the LM3S301-IGZ20-C2T by Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy for this microcontroller to be mounted directly onto a printed circuit board, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options, making it suitable for a wider range of applications.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easy to integrate into small electronic devices or systems.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex processing tasks efficiently, offering high performance capabilities.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with common power sources, making it easy to incorporate into existing systems.

No. of Terminals: 48

The large number of terminals allows for a wide range of input and output options, enabling versatile connectivity and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers excellent thermal performance, optimal signal integrity, and space-saving design.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage ensures efficient power management and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range indicates robustness and reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position offers efficient routing and connectivity options, enabling streamlined PCB layout and design.

ROM Words: 16384

With 16,384 ROM words, this microcontroller provides ample storage capacity for program code and data, supporting complex applications.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim profile, suitable for space-constrained applications and compact designs.

Width: 6.875 mm

The narrow width allows for dense packing on the PCB, maximizing space utilization and enabling multi-functionality in a limited area.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency provides fast processing speeds and real-time responsiveness for time-critical applications.

Length: 6.875 mm

The short length of the microcontroller contributes to a small overall footprint, ideal for applications where space is at a premium.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making this microcontroller suitable for industrial control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient instruction execution and reduced power consumption, ideal for embedded systems and IoT devices.

RAM Bytes: 2048

With 2,048 bytes of RAM, this microcontroller offers sufficient memory for data storage and temporary variables, supporting multitasking and data processing.

Technology: CMOS

The CMOS technology used in this microcontroller provides low power consumption, high noise immunity, and reliable performance, making it suitable for battery-powered devices and sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and assembly processes, ensuring reliable connections and ease of manufacturing.

Maximum Supply Current: 50 mA

The low maximum supply current consumption promotes energy efficiency and extends battery life in portable and battery-powered applications.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable operation and compatibility with standard power sources, simplifying system integration.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog devices, enabling applications such as motor control, audio modulation, and power management.

ROM Programmability: FLASH

The flash ROM programmability enables in-circuit programming and firmware updates, offering flexibility and scalability for evolving applications.

Terminal Pitch: 0.5 mm

The small terminal pitch facilitates high-density mounting on the PCB, enabling compact designs and efficient use of available space.

Speed: 20 rpm

With a speed of 20 revolutions per minute, this microcontroller can handle real-time control tasks and time-sensitive operations efficiently.

No. of I/O Lines: 33

The high number of input/output lines enables versatile connectivity and interface options, supporting complex systems and diverse peripheral devices.

Technical Specifications

Microcontrollers LM3S301-IGZ20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

33

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S301-IGZ20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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