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LM3S300-IQN25-C2

Texas Instruments

LM3S300-IQN25-C2 by Texas Instruments

Texas Instruments' LM3S300-IQN25-C2 microcontroller features 32-bit architecture, 4096 bytes of RAM, and a max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption, it offers connectivity through I2C, SSI, and UART interfaces.

Median Price

$4.748

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 23 parts In-Stock

1+ parts

$3.361

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-

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23

$3.361

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Chip1Stop

Japan . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.134

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250

-

-

$6.134

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Verical

USA . 23 parts In-Stock

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-

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23

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Distributors (In-Stock)

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Digiode

USA . 3,022 parts In-Stock

1+ parts

$4.633

100+ parts

-

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3,022

$4.633

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Vyrian

USA . 3,788 parts In-Stock

1+ parts

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3,788

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,970 parts In-Stock

1+ parts

$4.389

100+ parts

-

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3,970

$4.389

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Component Stockers USA

USA . 61 parts In-Stock

1+ parts

$6.810

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-

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61

$6.810

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AZTECH Wire

Italy . 725 parts In-Stock

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$16.330

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725

$16.330

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Microchip USA

USA . 365 parts In-Stock

1+ parts

$24.560

100+ parts

$24.380

1k+ parts

$24.380

10k+ parts

$24.210

365

$24.560

$24.380

$24.380

$24.210

Parana Technologies

USA . 1,023 parts In-Stock

1+ parts

$33.761

100+ parts

-

1k+ parts

$133.812

10k+ parts

-

1,023

$33.761

-

$133.812

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ChromeModa Solutions

Germany . 2,613 parts In-Stock

1+ parts

$37.934

100+ parts

$31.106

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2,613

$37.934

$31.106

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IDEA Electronic Components Group

UK . 2,288 parts In-Stock

1+ parts

$37.934

100+ parts

$36.037

1k+ parts

$34.141

10k+ parts

-

2,288

$37.934

$36.037

$34.141

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DigiPath Technology Company

USA . 1,909 parts In-Stock

1+ parts

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100+ parts

$34.201

1k+ parts

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1,909

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$34.201

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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A-Z Elektronik GmbH

Germany . 530 parts In-Stock

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530

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Kepictronics

USA . 353 parts In-Stock

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353

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Overview

Unlock new possibilities with the LM3S300-IQN25-C2 microcontroller by Texas Instruments. Designed with cutting-edge technology and precision engineering, this device offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers reliable and efficient operation. Experience seamless connectivity, low power consumption, and high-speed processing with the LM3S300-IQN25-C2. Elevate your projects with the quality and excellence that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material makes the product lightweight and cost-effective.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 3.6 V

The ability to handle a maximum supply voltage of 3.6V allows for flexibility in power supply options.

Package Shape: SQUARE

The square package shape enables easy mounting and placement on PCBs.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family ensures compatibility with a wide range of software and tools.

ROM Words: 16384

With a large ROM capacity of 16384 words, the microcontroller can store a significant amount of program code.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz allows for fast data processing and execution.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller being a RISC-based architecture ensures efficient and optimized performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Connectivity: I2C, SSI, UART(2)

Multiple connectivity options such as I2C, SSI, and UART(2) enable easy interfacing with external devices and systems.

Technical Specifications

Microcontrollers LM3S300-IQN25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

36

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

TIMER(3), WDT

Trade Compliance

LM3S300-IQN25-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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