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LM3S2D93-IBZ80-A2T

Texas Instruments

LM3S2D93-IBZ80-A2T by Texas Instruments

LM3S2D93-IBZ80-A2T by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 16.384 MHz. It features 67 I/O lines, ADC and DMA channels, and 98304 bytes of RAM. Ideal for industrial applications requiring high-speed processing and precise control in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 19,059 parts In-Stock

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Chip Stock

USA . 15,400 parts In-Stock

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Digiode

USA . 4,598 parts In-Stock

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Vyrian

USA . 4,194 parts In-Stock

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AZTECH Wire

Italy . 233 parts In-Stock

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$16.078

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One Stop Electronics

USA . 902 parts In-Stock

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$33.000

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Parana Technologies

USA . 968 parts In-Stock

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$52.690

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968

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ChromeModa Solutions

Germany . 2,984 parts In-Stock

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$59.202

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$48.546

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IDEA Electronic Components Group

UK . 1,034 parts In-Stock

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$59.202

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$56.242

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$53.282

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Authorized Procurement Solutions

USA . 63,000 parts In-Stock

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Lixinc

USA . 13,588 parts In-Stock

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Futuretech Components

Singapore . 5,500 parts In-Stock

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Corphita

USA . 3,710 parts In-Stock

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Kepictronics

USA . 3,407 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,039 parts In-Stock

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DigiPath Technology Company

USA . 2,284 parts In-Stock

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Microchip USA

USA . 417 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S2D93-IBZ80-A2T by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering customers unmatched value and benefits. From its advanced technology to its exceptional performance, the LM3S2D93-IBZ80-A2T provides the perfect solution for all your industrial needs. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexible power options and compatibility with a wide range of applications.

Package Shape: SQUARE

The square package shape is compact and efficient, saving space on the PCB and allowing for easier integration into designs.

Bit Size: 32

A 32-bit architecture enables high-performance computing capabilities, making this microcontroller suitable for complex tasks and applications.

Power Supplies (V): 1.3,3.3

Multiple power supply options provide flexibility in design and compatibility with various voltage requirements.

No. of Terminals: 108

A higher number of terminals allow for more connectivity options and peripheral attachments, enhancing the versatility of the microcontroller.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this microcontroller suitable for industrial environments with challenging conditions.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family offers high performance and energy efficiency, making this microcontroller ideal for a wide range of applications.

RAM Bytes: 98304

With a large RAM capacity, this microcontroller can handle complex data processing and multitasking efficiently.

Technical Specifications

Microcontrollers LM3S2D93-IBZ80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2D93-IBZ80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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