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LM3S2D93-IBZ80-A1

Texas Instruments

LM3S2D93-IBZ80-A1 by Texas Instruments

LM3S2D93-IBZ80-A1 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 16.384 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a low-profile package with a grid array style. The microcontroller has a supply voltage range of 3V to 3.6V and operates in temperatures ranging from -40°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,817 parts In-Stock

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Digiode

USA . 1,979 parts In-Stock

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AZTECH Wire

Italy . 518 parts In-Stock

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$9.070

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One Stop Electronics

USA . 442 parts In-Stock

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$16.000

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Parana Technologies

USA . 642 parts In-Stock

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$46.088

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DigiPath Technology Company

USA . 1,902 parts In-Stock

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$46.688

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ChromeModa Solutions

Germany . 6,231 parts In-Stock

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$51.784

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$42.463

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IDEA Electronic Components Group

UK . 1,938 parts In-Stock

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$51.784

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$49.195

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$46.606

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QUARKTWIN TECHNOLOGY LTD

USA . 5,784 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock the power of innovation with the LM3S2D93-IBZ80-A1 microcontroller by Texas Instruments. This cutting-edge device offers unparalleled performance and reliability, making it ideal for a wide range of applications. Whether you're designing consumer electronics, automotive systems, or industrial machinery, this microcontroller provides the perfect balance of speed, efficiency, and flexibility. Trust in Texas Instruments' reputation for excellence and choose the LM3S2D93-IBZ80-A1 for your next project. Experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for efficient assembly and space-saving on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making it versatile for various applications.

Package Shape: SQUARE

Square shape makes it easier to integrate into circuit designs and allows for efficient use of space.

Bit Size: 32

32-bit microcontroller offers high performance and capabilities for complex tasks.

No. of Terminals: 108

Large number of terminals provide flexibility for connecting to other components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enables high density mounting and improved signal integrity.

Minimum Supply Voltage: 3 V

Supports a low supply voltage, reducing power consumption and heat dissipation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in harsh environments without risk of malfunction.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, ideal for industrial applications in cold climates.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and inputs.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce CPU workload.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and allows for easier routing of traces.

Maximum Seated Height: 1.5 mm

Low profile design helps save space in compact electronic devices.

Width: 10 mm

Compact width dimension allows for easy integration into various electronic designs.

Maximum Clock Frequency: 16.384 MHz

High clock frequency enables fast processing speed for time-sensitive tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during the soldering process, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly without damage.

Length: 10 mm

Compact length dimension offers versatility in placement within electronic systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in rugged environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance and efficiency for processing complex instructions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form simplifies the assembly process and enhances solder joint reliability.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance and prevents voltage fluctuations.

PWM Channels: YES

Pulse width modulation channels allow for precise control of output signals, ideal for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and customization of the microcontroller's functions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting on PCBs and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the microcontroller can withstand exposure to moderate humidity levels during storage and assembly.

Speed: 80 rpm

Capable of processing tasks at a speed of 80 revolutions per minute, suitable for real-time applications.

No. of I/O Lines: 67

High number of input/output lines provide flexibility for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2D93-IBZ80-A1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2D93-IBZ80-A1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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