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LM3S2965-IQC50-A2T

Texas Instruments

LM3S2965-IQC50-A2T by Texas Instruments

Texas Instruments LM3S2965-IQC50-A2T is a 32-bit microcontroller with Cortex-M3 CPU, 262144 ROM words, and 65536 RAM bytes. It features 4 ADC channels, PWM(6), QEI, TIMER(4), WDT peripherals for industrial applications requiring low power mode and connectivity via CAN(2), I2C(2), SSI(2), UART(3).

Median Price

$23.140

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1,000 parts In-Stock

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$23.140

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$23.140

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Distributors (In-Stock)

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Vyrian

USA . 5,239 parts In-Stock

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Digiode

USA . 4,225 parts In-Stock

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4,225

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AZTECH Wire

Italy . 1,141 parts In-Stock

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$12.030

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Microchip USA

USA . 1,926 parts In-Stock

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$57.040

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$56.040

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$55.550

10k+ parts

$55.050

1,926

$57.040

$56.040

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$55.050

Parana Technologies

USA . 2,310 parts In-Stock

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$65.182

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2,310

$65.182

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ChromeModa Solutions

Germany . 6,648 parts In-Stock

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$73.238

100+ parts

$60.055

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6,648

$73.238

$60.055

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IDEA Electronic Components Group

UK . 891 parts In-Stock

1+ parts

$73.238

100+ parts

$69.576

1k+ parts

$65.914

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891

$73.238

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$65.914

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Component Stockers USA

USA . 419 parts In-Stock

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$99.990

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DigiPath Technology Company

USA . 922 parts In-Stock

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$66.031

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922

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Corphita

USA . 394 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S2965-IQC50-A2T by Texas Instruments. Designed with precision and quality in mind, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile device delivers seamless connectivity and advanced features, making it the ideal choice for your next project. Experience the value and benefits of Texas Instruments' expertise in microcontroller technology with the LM3S2965-IQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the components inside the microcontroller, making it suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the microcontroller by reducing the access time to frequently used data, enhancing overall efficiency.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto printed circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

This voltage level ensures compatibility with a variety of power sources while providing sufficient power for the microcontroller to operate effectively.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage, contributing to the overall performance of the microcontroller.

Package Shape: SQUARE

The square shape of the package provides a more compact form factor, making it easier to integrate into designs with limited space constraints.

Bit Size: 32

A 32-bit architecture allows for more complex calculations and data processing, making the microcontroller suitable for tasks that require higher computational power.

Power Supplies (V): 2.5,3.3

Supporting multiple voltage options provides flexibility in powering the device, accommodating different voltage requirements for various applications.

No. of Terminals: 100

Having a large number of terminals allows for more connections and interfacing possibilities, enabling the microcontroller to interact with a wide range of external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers versatility in mounting options and compatibility with different board layouts.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage ensures that the microcontroller can operate reliably at lower power levels, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial applications.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures compatibility with ARM architecture and provides access to a wide range of development tools and resources.

Minimum Operating Temperature: -40 °C

The ability to operate at extreme low temperatures makes this microcontroller suitable for applications in cold environments or outdoor settings.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides good conductivity and corrosion resistance, ensuring reliable connections between the microcontroller and external components.

ADC Channels: YES

Having analog-to-digital converter channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections, reducing the risk of signal interference and ensuring reliable performance.

ROM Words: 262144

With a large ROM capacity, this microcontroller can store a significant amount of program data, enabling complex algorithms and applications to be run efficiently.

Maximum Seated Height: 1.6 mm

The low seated height allows for a slim profile and easy integration into compact designs, making it suitable for devices with space constraints.

Width: 14 mm

The compact width of the microcontroller makes it versatile for a variety of applications, including those with size limitations or where space is a concern.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microcontroller during production, ensuring high quality and reliability.

Peripherals: PWM(6), QEI, TIMER(4), WDT

The diverse range of peripherals provides flexibility in interfacing with external devices and sensors, expanding the functionality and capabilities of the microcontroller.

Maximum Clock Frequency: 50 MHz

The high clock frequency allows for fast data processing and response times, making the microcontroller suitable for applications that require rapid computations.

Maximum Time At Peak Reflow Temperature(s): 30

The specified reflow time ensures proper soldering and assembly of the microcontroller onto PCBs, contributing to the overall reliability of the product.

Peak Reflow Temperature°C: 260

The high peak reflow temperature enables secure and durable soldering of the microcontroller during assembly, ensuring reliable connections and performance.

Length: 14 mm

The compact length of the microcontroller makes it suitable for applications where space is limited or where a smaller footprint is desired.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the microcontroller can operate reliably in harsh environments with temperature fluctuations, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enables efficient data processing and execution of instructions, providing high performance and reliability.

No. of Timers: 4

Having multiple timers allows for precise scheduling and control of tasks, enhancing the versatility and efficiency of the microcontroller in various applications.

RAM Bytes: 65536

With a large RAM capacity, the microcontroller can store and process significant amounts of data, enabling complex algorithms and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for energy-efficient and reliable applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable signal transmission and preventing signal loss or interference.

Analog To Digital Convertors: 4-Ch 10-Bit

Having multiple ADC channels with 10-bit resolution allows the microcontroller to accurately convert analog signals to digital data for processing and analysis.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides the optimal operating condition for the microcontroller, ensuring reliable performance and longevity.

No. of Serial I/Os: 9

The multiple serial I/O ports offer versatile connectivity options for interfacing with external devices, expanding the functionality and compatibility of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of digital signals, enabling applications such as motor control, LED dimming, and analog signal generation.

Connectivity: CAN(2), I2C(2), SSI(2), UART(3)

The variety of connectivity options, including CAN, I2C, SSI, and UART interfaces, provide versatile communication capabilities for interfacing with different devices and systems.

ROM Programmability: FLASH

The flash ROM programmability enables easy and efficient updating of the microcontroller's firmware or program code, ensuring flexibility and ease of maintenance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density packaging and efficient use of board space, making the microcontroller suitable for compact designs.

Format: FIXED POINT

Using a fixed-point format simplifies arithmetic operations and calculations, offering faster and more efficient processing for various applications.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the microcontroller has moderate sensitivity to moisture, requiring proper handling and storage to maintain its reliability.

Speed: 50 rpm

The specified speed rating of 50 rpm indicates the maximum rotational speed of the microcontroller, which can be important for applications with moving parts or mechanical functions.

Technical Specifications

Microcontrollers LM3S2965-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

9

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SSI(2), UART(3)

Peripherals:

PWM(6), QEI, TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S2965-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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