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LM3S2950-IBZ50-A2

Texas Instruments

LM3S2950-IBZ50-A2 by Texas Instruments

LM3S2950-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 50 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With a wide temperature range from -40 to 85°C, this microcontroller is ideal for use in harsh environments where reliability is crucial.

Median Price

$15.325

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$12.260

1k+ parts

$10.970

10k+ parts

$10.330

552

-

$12.260

$10.970

$10.330

DigiKey

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$16.140

1k+ parts

-

10k+ parts

-

552

-

$16.140

-

-

Verical

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$15.325

1k+ parts

$13.713

10k+ parts

$12.912

552

-

$15.325

$13.713

$12.912

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 345 parts In-Stock

1+ parts

$12.939

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$12.939

-

-

-

Vyrian

USA . 5,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,287

-

-

-

-

Chip Stock

USA . 677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

677

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,958 parts In-Stock

1+ parts

$12.258

100+ parts

-

1k+ parts

-

10k+ parts

-

2,958

$12.258

-

-

-

Component Stockers USA

USA . 499 parts In-Stock

1+ parts

$13.960

100+ parts

$13.120

1k+ parts

-

10k+ parts

-

499

$13.960

$13.120

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$44.421

100+ parts

$40.423

1k+ parts

$36.425

10k+ parts

-

500

$44.421

$40.423

$36.425

-

Microchip USA

USA . 1,330 parts In-Stock

1+ parts

$51.550

100+ parts

$50.820

1k+ parts

$50.450

10k+ parts

$50.080

1,330

$51.550

$50.820

$50.450

$50.080

Parana Technologies

USA . 304 parts In-Stock

1+ parts

$66.928

100+ parts

$6,215.280

1k+ parts

$60.235

10k+ parts

-

304

$66.928

$6,215.280

$60.235

-

DigiPath Technology Company

USA . 1,303 parts In-Stock

1+ parts

$73.696

100+ parts

$67.800

1k+ parts

-

10k+ parts

-

1,303

$73.696

$67.800

-

-

ChromeModa Solutions

Germany . 6,564 parts In-Stock

1+ parts

$75.200

100+ parts

$61.664

1k+ parts

-

10k+ parts

-

6,564

$75.200

$61.664

-

-

IDEA Electronic Components Group

UK . 2,142 parts In-Stock

1+ parts

$75.200

100+ parts

$71.440

1k+ parts

$67.680

10k+ parts

-

2,142

$75.200

$71.440

$67.680

-

Kepictronics

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

552

-

-

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-

Overview

Experience innovation like never before with the Texas Instruments LM3S2950-IBZ50-A2 microcontroller. Designed for cutting-edge applications, this product offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, known for their superior technology, this microcontroller is a game-changer in the field. Perfect for a wide range of applications, the LM3S2950-IBZ50-A2 provides unmatched value, benefits, and advantages to customers looking for high-performance solutions. Upgrade your projects today with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage helps in minimizing power consumption and heat generation.

Package Shape: SQUARE

Square package shape contributes to efficient use of board space and allows for compact design.

Bit Size: 32

32-bit architecture provides high computational power and enhanced performance.

Power Supplies (V): 2.5,3.3

Multiple power supply options offer flexibility in voltage requirements for different applications.

No. of Terminals: 108

High number of terminals enable connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures secure and precise placement on the circuit board.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage allows for reliable operation even with fluctuating power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the product suitable for industrial environments with varying ambient conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures functionality in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing and sensor integration.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on the circuit board.

ROM Words: 262144

Large ROM capacity allows for storing a vast amount of program data and code.

Maximum Seated Height: 1.5 mm

Low seated height enables slim and compact overall product design.

Width: 10 mm

Narrow width dimension aids in space-saving integration within tight PCB layouts.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency provides fast data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints and robust assembly.

Length: 10 mm

Short length dimension contributes to a compact and space-efficient design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance guarantees performance reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture offers efficient instruction execution and power consumption.

RAM Bytes: 65536

Large RAM capacity allows for efficient data storage and processing during operation.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form facilitates easy rework and soldering processes during assembly and maintenance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Availability of PWM channels enables precise control of pulse width modulation for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of program code and data.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables dense packing and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard reflow soldering processes.

Speed: 50 rpm

Operational speed of 50 rpm ensures fast data processing and response times for real-time applications.

No. of I/O Lines: 60

A high number of I/O lines provide ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2950-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2950-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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